B41J 2/1646
Thin film formation by sputtering
Official title: {thin film formation by sputtering}
B41J2/1646 (Thin film formation by sputtering) appears on 2,690 US grants and 2,418 published applications in this corpus.
Search patents in B41J- Granted patents
- 2,690
- Published applications
- 2,418
- Assignees
- 169
- Inventors
- 1,814
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 7 | 0 |
| 1987 | 5 | 0 |
| 1988 | 7 | 0 |
| 1989 | 9 | 0 |
| 1990 | 10 | 0 |
| 1991 | 7 | 0 |
| 1992 | 15 | 0 |
| 1993 | 15 | 0 |
| 1994 | 7 | 0 |
| 1995 | 15 | 0 |
| 1996 | 21 | 0 |
| 1997 | 36 | 0 |
| 1998 | 44 | 0 |
| 1999 | 48 | 0 |
| 2000 | 66 | 0 |
| 2001 | 131 | 36 |
| 2002 | 145 | 131 |
| 2003 | 106 | 96 |
| 2004 | 109 | 200 |
| 2005 | 124 | 271 |
| 2006 | 185 | 189 |
| 2007 | 144 | 163 |
| 2008 | 148 | 205 |
| 2009 | 171 | 216 |
| 2010 | 184 | 140 |
| 2011 | 200 | 100 |
| 2012 | 82 | 78 |
| 2013 | 84 | 97 |
| 2014 | 100 | 60 |
| 2015 | 96 | 52 |
| 2016 | 58 | 45 |
| 2017 | 43 | 51 |
| 2018 | 43 | 55 |
| 2019 | 52 | 45 |
| 2020 | 39 | 24 |
| 2021 | 30 | 18 |
| 2022 | 18 | 36 |
| 2023 | 20 | 26 |
| 2024 | 20 | 28 |
| 2025 | 14 | 30 |
| 2026 | 20 | 26 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Liquid dispensing head and liquid dispensing device16 Jun 2026US 12,654,447 B2RISO Technologies Corporation
- Liquid discharge head, element substrate and method for manufacturing the same5 May 2026US 12,617,203 B2Canon Kabushiki Kaisha
- Liquid ejection head chip, liquid jet head, and liquid jet recording device for ejecting liquid28 Apr 2026US 12,611,863 B2Sii Printek Inc.
- Manufacturing method of liquid discharge head and liquid discharge head10 Sep 2026US 2026/0264405 A1Seiko Epson Corporation
- Inkjet printing apparatus, inkjet printing method, and electronic device3 Sep 2026US 2026/0257477 A1Samsung Display Co., Ltd.
- Manufacturing method for semiconductor substrate, manufacturing method for liquid ejection head, semiconductor substrate, and liquid ejection head13 Aug 2026US 2026/0233519 A1Canon Kabushiki Kaisha
- Method of manufacturing nozzle plate and nozzle plate13 Aug 2026US 2026/0233525 A1Seiko Epson Corporation
- Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus13 Aug 2026US 2026/0239883 A1Seiko Epson Corporation
Most cited
By later US patents
- Ink jet head and a method of manufacturing thereof420US 5,666,141 ASharp Kabushiki Kaisha · 1997
- Ink-jet recording head with piezoelectric device and method for manufacturing the same368US 6,142,615 ASeiko Epson Corporation · 2000
- Document having an encoded data structure288US 7,234,645 B2Silverbrook Research Pty Ltd · 2007
- Wide format pagewidth inkjet printer287US 6,672,706 B2Silverbrook Research Pty Ltd · 2004
- Printhead assembly for an ink jet printer236US 6,652,082 B2Silverbrook Research Pty Ltd · 2003