B32B 15/092
Comprising epoxy resins
Official title: comprising epoxy resins
B32B15/092 (Comprising epoxy resins) appears on 409 US grants and 621 published applications in this corpus.
Search patents in B32B- Granted patents
- 409
- Published applications
- 621
- Assignees
- 336
- Inventors
- 1,528
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 2 |
| 2003 | 4 | 2 |
| 2004 | 3 | 7 |
| 2005 | 6 | 4 |
| 2006 | 0 | 9 |
| 2007 | 2 | 7 |
| 2008 | 1 | 1 |
| 2009 | 4 | 10 |
| 2010 | 4 | 11 |
| 2011 | 2 | 5 |
| 2012 | 2 | 9 |
| 2013 | 3 | 18 |
| 2014 | 6 | 17 |
| 2015 | 10 | 23 |
| 2016 | 9 | 21 |
| 2017 | 22 | 56 |
| 2018 | 26 | 88 |
| 2019 | 40 | 63 |
| 2020 | 50 | 65 |
| 2021 | 41 | 60 |
| 2022 | 37 | 45 |
| 2023 | 45 | 34 |
| 2024 | 33 | 22 |
| 2025 | 20 | 31 |
| 2026 | 14 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Polymer-laminated metal lid18 Aug 2026US 12,709,084 B2Altria Client Services LLC
- Corrosion resistant structure18 Aug 2026US 12,709,688 B2Industrial Technology Research Institute
- Thermoplastic epoxy materials with core shell phase23 Jun 2026US 12,661,878 B2Zephyros, Inc.
- Resin composition, layered body including resin composition layer, layered body, flexible copper-clad laminate, flexible flat cable, and electromagnetic wave shielding film26 May 2026US 12,637,565 B2Toagosei Co., Ltd.
- Electrically conductive bonding tape with low passive intermodulation24 Mar 2026US 12,584,043 B23M Innovative Properties Company
- Epoxy resin composition, varnish, inorganic composite sheet, and metal-based substrate17 Sep 2026US 2026/0275152 A1DIC Corporation
- Laminate and resin-coated metal foil30 Jul 2026US 2026/0217989 A1Panasonic Intellectual Property Management Co., Ltd.
- Method for producing joined object23 Jul 2026US 2026/0210390 A1Resonac Corporation
- Resin composition, prepreg, metal foil-clad laminate and printed circuit board16 Jul 2026US 2026/0206133 A1Zeon Corporation
- Aluminium alloy foil with reduced cracking during molding, battery packaging material, and battery18 Jun 2026US 2026/0166854 A1Dai Nippon Printing Co.Ltd.
Most cited
By later US patents
- Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite112US 4,888,247 AGeneral Electric Company · 1989
- Process for treating copper surface74US 4,902,551 AHitachi Chemical Company, Ltd. · 1990
- Multi-layer, heat-curable adhesive film40US 4,908,273 ACiba-Geigy Corporation · 1990
- Composite and method for producing the same35US 10,532,545 B2Oji Holdings Corporation · 2020
- Novel multi-layer articles32US 4,656,094 ANippon Petrochemicals Company, Limited · 1987