B29L 2017/006
Memory cards, chip cards
Official title: {Memory cards, chip cards}
B29L2017/006 (Memory cards, chip cards) appears on 53 US grants and 50 published applications in this corpus.
Search patents in B29L- Granted patents
- 53
- Published applications
- 50
- Assignees
- 39
- Inventors
- 100
- Latest grant
- 27 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 0 |
| 2002 | 2 | 2 |
| 2003 | 1 | 2 |
| 2004 | 1 | 0 |
| 2005 | 0 | 3 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 1 | 3 |
| 2014 | 1 | 2 |
| 2015 | 4 | 3 |
| 2016 | 2 | 4 |
| 2017 | 4 | 3 |
| 2018 | 0 | 3 |
| 2019 | 5 | 6 |
| 2020 | 3 | 2 |
| 2021 | 3 | 4 |
| 2022 | 5 | 3 |
| 2023 | 1 | 0 |
| 2024 | 0 | 2 |
| 2025 | 1 | 2 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing smart card27 May 2025US 12,312,514 B2Dexerials Corporation
- DI metal transaction devices and processes for the manufacture thereof4 Apr 2023US 11,618,191 B2CompoSecure, LLC
- Process for pick and place of electronic components in a vacuum27 Dec 2022US 11,537,758 B2
- Elevator with debowing mechanism13 Sep 2022US 11,440,239 B2Entrust Corporation
- Molded pocket in transaction card construction29 Mar 2022US 11,285,644 B2Capital One Services, LLC
- Tire, and method for manufacturing same23 Apr 2026US 2026/0109180 A1The Yokohama Rubber Co., Ltd.
- Method for manufacturing smart card, smart card, and conductive particle-containing hot-melt adhesive sheet7 Aug 2025US 2025/0250466 A1Dexerials Corporation
- Method for producing a film having a security feature for a card-shaped data carrier, film and card-shaped data carrier30 Jan 2025US 2025/0033265 A1Giesecke+Devrient Epayments GmbH
- Forming method of water-soluble protective film, and processing method of plate-shaped object26 Dec 2024US 2024/0424743 A1Disco Corporation
- Bonded body, substrate, method for producing bonded body, and method for producing substrate21 Mar 2024US 2024/0092061 A1Daikin Industries, Ltd.
Most cited
By later US patents
- Card-typed electronic apparatus having a flat card case housing a plurality of electronic parts141US 6,381,143 B1Kabushiki Kaisha Toshiba · 2002
- Method of producing data carriers82US 6,065,681 AOrga Kartensysteme GmbH · 2000
- Method of making IC card65US 5,735,040 AMitsubishi Denki Kabushiki Kaisha · 1998
- Method and apparatus for producing a plastic molded chip card having reduced wall thickness56US 5,681,356 AGAO Gesellschaft fur Automation und Organisation mbH · 1997
- Cards with special texture and color54US 9,390,363 B1CompoSecure, LLC · 2016