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US 11,285,644 B2Granted
Molded pocket in transaction card construction
AssigneeCapital One Services, LLC
InventorsCarl Alexander Cepress, Elwin Ching Yee Ong
Life of this patent
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Abstract
Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.
Claims20
A method of manufacturing a transaction card, the method comprising:
- placing a heated material for forming a transaction card frame into a cavity of a mold, the mold comprising a protrusion on a surface of the mold to form at least one recessed portion in the transaction card frame, wherein the mold comprises a first through hole and a second through hole, and wherein the at least one recessed portion in the transaction card frame includes a first surface recessed a first depth from an outer surface and a second surface recessed a second depth from the first surface;
- extending a first pin through the first through hole and a second pin through the second through hole to release the transaction card frame from the mold, wherein a first mark is left in the at least one recessed portion by the pin and a second mark is left on an outer surface of the transaction card frame;
- and
- installing an electronic component into the at least one recessed portion, wherein the electronic component comprises a transaction card microchip to cover the first mark.
1 more element
Dependencies are inferred from the claim text.