DI metal transaction devices and processes for the manufacture thereof

A transaction device comprising:

• a metal layer having a front surface, a back surface, a periphery, and one or more discontinuities in the metal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer;
• a first non-metal, reinforcing layer disposed over the front surface of the metal layer;
• a booster antenna disposed over the back surface of the metal layer, the booster antenna comprising a plurality of metallizations isolated from the metal layer;
• a second non-metal, reinforcing layer disposed over the back surface of the metal layer;
• an opening in the metal layer extending through the first non-metal, reinforcing layer;
• a transponder chip module disposed in the opening, the transponder chip module in communication with the booster antenna and together with the booster antenna comprising a payment circuit configured for wireless communication with a device reader.

A transaction device comprising:

• a metal layer having a front surface, a back surface, and a periphery;
• an opening in the metal layer extending from the metal layer to a top surface of the device;
• one or more discontinuities in the metal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending between the periphery of the metal layer and the opening in the metal layer;
• a back fiber-reinforced epoxy laminate material layer disposed over the back surface of the metal layer;
• a booster antenna;
• a transponder chip module disposed in the opening and having a top surface accessible from the top surface of the device, the transponder chip module in communication with the booster antenna and together with the booster antenna comprising a payment circuit configured for wireless communication with a device reader.

A process for manufacturing a transaction device, the process comprising steps of:

• (a) providing a metal layer having a front surface, a back surface, and a periphery;
• (b) forming one or more discontinuities in the metal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer;
• (c) disposing a booster antenna over the back surface of the metal layer, the booster antenna comprising a plurality of metallizations;
• (d) disposing a first fiberglass layer over the front surface of the metal layer;
• (e) disposing a second fiberglass layer over the back surface of the metal layer;
• (f) forming an opening in the metal layer extending through the first fiberglass layer to a top surface of the device;
• (h) disposing a transponder chip module in the opening.

A process for manufacturing a transaction device, the process comprising steps of:

• (a) providing a premade laminate comprising
• a metal layer having a front surface, a back surface, and a periphery;
• a first cured fiber-reinforced epoxy laminate layer bonded to the front surface of the metal layer;
• a second cured fiber-reinforced epoxy laminate layer bonded to the back surface of the metal layer;
• (b) forming one or more discontinuities in the metal layer of the premade laminate, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer, each of the one or more discontinuities also extending through at least one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer;
• (c) disposing a booster antenna over an outer surface of one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer, the booster antenna comprising a plurality of metallizations;
• (d) forming an opening in the metal layer extending through the first fiberglass layer to a top surface of the device;
• (h) disposing a transponder chip module in the opening.