Bonded body, substrate, method for producing bonded body, and method for producing substrate

Abstract

A joined article including: a resin (1) having a linear expansion coefficient at 30° C. to 200° C. of 17 ppm/° C. or higher and a thickness of 5 to 100 μm; and a metal joined to a surface of the resin (1) and having a thickness of 5 to 50 μm. The resin (1) includes a heat-affected layer that is close to the metal and that occupies 80% or less of the thickness of the resin (1), and the joined article is a dielectric material for a substrate. Also disclosed is a substrate including the joined article and a resin (2) stacked on the joined article.

Dependencies are inferred from the claim text.