Method of making IC card
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsKatsunori Ochi, Seiji Takemura, Syojiro Kodai, Tuguo Kurisu
Life of this patent
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Abstract
A method of producing a thin IC card having a built-in battery includes forming a through-hole including an edge in a circuit board having obverse and reverse main surfaces, a circuit pattern being present on a first of the main surfaces of the circuit board; mounting a functional part on the first of the main surfaces of the circuit board; molding said circuit board and said functional part in a resin with a second main surface of said circuit exposed and forming a battery lodging section in the resin molding defined by the through-hole; and mounting a battery in said battery lodging section and electrically connecting the circuit pattern to the battery.
Claims8
A method of producing a thin IC card having a built-in battery comprising:
- forming a through-hole including an edge, in a circuit board, the circuit board having first and second main surfaces, a circuit pattern being present on the first main surface;
- mounting a functional part on the first main surface;
- forming a card-shaped section including:
- inserting the circuit board with the functional part into a mold, the mold including a first protrusion extending through the through-hole in the circuit board;
- and
- injecting a resin into the mold to form the card-shaped section including a battery lodging section at the through hole, the resin covering the first main surface but not the second main surface;
- and
- mounting a battery in the battery lodging section and electrically connecting the circuit pattern to the battery.
Dependencies are inferred from the claim text.