B29K 2077/00
Use of pa, i.e. polyamides
Official title: Use of {PA, i.e.} polyamides, e.g. polyesteramides {or derivatives thereof}, as moulding material
B29K2077/00 (Use of pa, i.e. polyamides) appears on 2,243 US grants and 3,054 published applications in this corpus.
Search patents in B29K- Granted patents
- 2,243
- Published applications
- 3,054
- Assignees
- 1,407
- Inventors
- 6,072
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 4 | 0 |
| 1978 | 7 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 1 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 16 | 0 |
| 1985 | 15 | 0 |
| 1986 | 10 | 0 |
| 1987 | 11 | 0 |
| 1988 | 17 | 0 |
| 1989 | 16 | 0 |
| 1990 | 7 | 0 |
| 1991 | 12 | 0 |
| 1992 | 14 | 0 |
| 1993 | 16 | 0 |
| 1994 | 19 | 0 |
| 1995 | 22 | 0 |
| 1996 | 25 | 0 |
| 1997 | 18 | 0 |
| 1998 | 26 | 0 |
| 1999 | 26 | 0 |
| 2000 | 19 | 0 |
| 2001 | 32 | 10 |
| 2002 | 21 | 39 |
| 2003 | 34 | 59 |
| 2004 | 34 | 71 |
| 2005 | 31 | 66 |
| 2006 | 30 | 94 |
| 2007 | 28 | 100 |
| 2008 | 37 | 125 |
| 2009 | 26 | 121 |
| 2010 | 61 | 160 |
| 2011 | 81 | 109 |
| 2012 | 88 | 103 |
| 2013 | 67 | 83 |
| 2014 | 77 | 98 |
| 2015 | 70 | 156 |
| 2016 | 74 | 173 |
| 2017 | 114 | 186 |
| 2018 | 108 | 161 |
| 2019 | 127 | 162 |
| 2020 | 133 | 178 |
| 2021 | 121 | 164 |
| 2022 | 122 | 169 |
| 2023 | 108 | 126 |
| 2024 | 119 | 161 |
| 2025 | 104 | 103 |
| 2026 | 61 | 77 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Polyamide resin composition6 Oct 2026US 12,753,308 B2Ube Corporation
- Process of modifying surface of a composite material base unit29 Sep 2026US 12,746,716 B2BASF SE Ludwigshafen am Rhein
- Compound for bonded magnet, bonded magnet, method of producing same, and resin composition for bonded magnets29 Sep 2026US 12,749,619 B2Nichia Corporation
- Continuous-fiber-reinforced resin molding and method for manufacturing same15 Sep 2026US 12,734,765 B2Asahi Kasei Kabushiki Kaisha
- Fusing agents with triazine radiation absorbers for three-dimensional printing8 Sep 2026US 12,728,593 B2Peridot Print LLC
- High puncture resistant recyclable packaging film with polar polymer outer layer8 Oct 2026US 2026/0307317 A1ProAmpac Holdings Inc.
- Additive production device and associated additive production method8 Oct 2026US 2026/0307327 A1EOS GmbH Electro Optical Systems
- Multi-jet fusion printing of porous structures8 Oct 2026US 2026/0308398 A1Nanyang Technological University
- On- and offshore long-chain polyamide tube with increased barrier effect1 Oct 2026US 2026/0295917 A1Evonik Operations GmbH
- High melt temperature soluble semi-crystalline polyamides1 Oct 2026US 2026/0297255 A1Syensqo Specialty Polymers USA, LLC
Most cited
By later US patents
- Three dimensional printing328US 9,149,988 B2Markforged, Inc. · 2015
- Sinterable semi-crystalline powder and near-fully dense article formed therewith268US 5,342,919 ADTM Corporation · 1994
- Three dimensional printing of composite reinforced structures257US 9,186,848 B2Markforged, Inc. · 2015
- Squeezable multi-layer dispensing container with one-way valve197US 5,332,121 AContinental PET Technologies, Inc. · 1994
- Methods for fiber reinforced additive manufacturing188US 9,370,896 B2Markforged, Inc. · 2016