B29C 65/006
Diffusion joining
Official title: {Diffusion joining (measures for intermixing the material of the joint interlayer B29C66/341)}
B29C65/006 (Diffusion joining) appears on 25 US grants and 33 published applications in this corpus.
Search patents in B29C- Granted patents
- 25
- Published applications
- 33
- Assignees
- 33
- Inventors
- 91
- Latest grant
- 17 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 4 |
| 2006 | 0 | 2 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 1 | 2 |
| 2010 | 1 | 2 |
| 2011 | 1 | 0 |
| 2012 | 1 | 3 |
| 2013 | 1 | 1 |
| 2014 | 2 | 1 |
| 2015 | 1 | 1 |
| 2016 | 0 | 2 |
| 2017 | 2 | 2 |
| 2018 | 3 | 2 |
| 2019 | 1 | 1 |
| 2020 | 3 | 2 |
| 2021 | 0 | 2 |
| 2022 | 1 | 0 |
| 2023 | 1 | 1 |
| 2024 | 1 | 0 |
| 2025 | 1 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of forming implants using heat bonding17 Jun 2025US 12,329,645 B2SMed-TA/TD, LLC
- Joining method and assembly for an aircraft29 Oct 2024US 12,128,635 B2Airbus SAS
- Joining method and assembly for an aircraft11 Jul 2023US 11,697,251 B2Airbus SAS
- Reinforced superplastic formed and diffusion bonded structures1 Mar 2022US 11,260,952 B2The Boeing Company
- Attachment method using anodic bonding29 Sep 2020US 10,788,793 B2Sy & SE SA
- Chip and encapsulation method therefor9 Apr 2026US 2026/0097398 A1Genemind Biosciences Company Limited
- Method for foam bonding via surface dissolution and foam laminate therefrom28 Aug 2025US 2025/0269608 A1Cruz Foam, Inc.
- Joining method and assembly for an aircraft12 Oct 2023US 2023/0321926 A1Airbus SAS
- Joining method and assembly for an aircraft7 Oct 2021US 2021/0308956 A1Airbus SAS
- Reinforced superplastic formed and diffusion bonded structures1 Apr 2021US 2021/0094670 A1The Boeing Company
Most cited
By later US patents
- Microfluidic devices for introducing and dispensing fluids from microfluidic systems235US 6,951,632 B2Fluidigm Corporation · 2005
- Method and apparatus for direct bonding two bodies63US 5,421,953 ANippondenso Co., Ltd. · 1995
- Method of bonding plastics25US 4,999,069 AIntegrated Fluidics, Inc. · 1991
- Microfluidic structure23US 9,592,501 B2Landegren Gene Technology AB · 2017
- Plastic bonding method15US 8,580,069 B2Kuraray Co., Ltd. · 2013