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US 12,329,645 B2Granted
Methods of forming implants using heat bonding
AssigneeSMed-TA/TD, LLC
InventorsGregory C. Stalcup, Joseph W. Jurick
Life of this patent
Estimating the term…
Abstract
A method of forming an orthopaedic implant includes: placing a bonding portion of a mating part in an opening formed in an implant body, the opening defining a variable opening width; and heat bonding the bonding portion to the material to bond the mating part to the implant body.
Claims11
A method of forming an orthopaedic implant, comprising:
- placing a bonding portion of a mating part in an opening formed in an implant body, the opening defining a variable opening width, the implant body including a first wall that forms a bottom surface of the opening, the bottom surface of the opening of the implant body being positioned directly below a bottom surface of the bonding portion, the mating part including a post extending perpendicularly from the bonding portion, the implant body including a plurality of second walls defining the opening width and extending from the bottom surface of the opening of the implant body to a top surface of the implant body, the top surface of the implant body being perpendicular relative to a longitudinal axis of the post, a top surface of the bonding portion of the mating part being perpendicular relative to the longitudinal axis of the post;
- and
- heat bonding the bonding portion to a material to bond the mating part to the implant body.
Dependencies are inferred from the claim text.