B29C 45/14647
Making flat card-like articles with an incorporated ic or chip module
Official title: {Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards}
B29C45/14647 (Making flat card-like articles with an incorporated ic or chip module) appears on 81 US grants and 71 published applications in this corpus.
Search patents in B29C- Granted patents
- 81
- Published applications
- 71
- Assignees
- 49
- Inventors
- 123
- Latest grant
- 25 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 1 |
| 2002 | 0 | 2 |
| 2003 | 1 | 0 |
| 2004 | 1 | 3 |
| 2005 | 1 | 5 |
| 2006 | 3 | 8 |
| 2007 | 5 | 9 |
| 2008 | 4 | 7 |
| 2009 | 6 | 2 |
| 2010 | 1 | 3 |
| 2011 | 3 | 3 |
| 2012 | 5 | 2 |
| 2013 | 2 | 2 |
| 2014 | 2 | 3 |
| 2015 | 1 | 0 |
| 2016 | 2 | 0 |
| 2017 | 1 | 2 |
| 2018 | 0 | 1 |
| 2019 | 4 | 8 |
| 2020 | 3 | 1 |
| 2021 | 4 | 6 |
| 2022 | 3 | 1 |
| 2023 | 1 | 1 |
| 2024 | 2 | 1 |
| 2025 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card25 Nov 2025US 12,481,843 B1Metaland LLC
- Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card3 Jun 2025US 12,321,801 B2Metaland LLC
- Electronic device member of metallic structure and non-metallic structure, and method for manufacturing same20 Aug 2024US 12,064,907 B2Samsung Electronics Co., Ltd.
- Manufacturing implantable tissue stimulators25 Jun 2024US 12,017,082 B2Curonix LLC
- DI metal transaction devices and processes for the manufacture thereof4 Apr 2023US 11,618,191 B2CompoSecure, LLC
- Method for manufacturing an interior component for vehicles26 Sep 2024US 2024/0316842 A1Lisa Dräxlmaier GmbH
- Encapsulating A Metal Inlay With Thermosetting Resin And Method For Making A Metal Transaction Card23 Mar 2023US 2023/0086189 A1Metaland LLC
- Vehicle-integrated lidar system24 Mar 2022US 2022/0091270 A1GM Global Technology Operations LLC
- Electronic device member of metallic structure and non-metallic structure, and method for manufacturing same11 Nov 2021US 2021/0347098 A1Samsung Electronics Co., Ltd.
- Molded pocket in transaction card construction9 Sep 2021US 2021/0276234 A1Capital One Services, LLC
Most cited
By later US patents
- Method of making smart cards315US 5,955,021 ACardXX, Inc. · 1999
- Method for making smart cards using isotropic thermoset adhesive materials281US 6,256,873 B1CardXX, Inc. · 2001
- Method for making tamper-preventing, contact-type, smart cards276US 6,241,153 B1CardXX, Inc. · 2001
- Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces260US 7,225,537 B2CardXX, Inc. · 2007
- Method for making a credit card containing a microprocessor chip214US 5,134,773 A1992