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US 6,241,153 B1Granted
Method for making tamper-preventing, contact-type, smart cards
AssigneeCardXX, Inc.
InventorHarry J. Tiffany, III
Life of this patent
Estimating the term…
Abstract
Smart cards having high quality external surfaces can be made through use of a primer/adhesive (and, optionally, anchor hooks) on the lower surface of an electrical component in order to affix said electrical component to a thermosetting material that becomes the core layer of said cards.
Claims76
A method for making a contact type smart card comprising a top layer in which an electrical sensing device resides, a core layer and a bottom layer, said method comprising:
- (1) coating a layer of primer and/or adhesive on the underside of the electrical sensor device such that said layer of primer/adhesive will come into direct physical contact with a thermosetting polymeric material that forms the core layers of the smart card;
- (2) positioning the electrical sensor device in an opening in the top layer;
- (3) positioning the top layer and bottom layer in a mold set up that defines a void space between the top layer and the bottom layer;
- (4) injecting a thermosetting polymeric material into the void space under conditions such that the primer/adhesive comes into direct physical contact with the thermosetting polymeric material to form a unified precursor smart card body;
- (5) removing the unified precursor smart card body from the mold set up;
- and
- (6) trimming the precursor smart card to a desired dimension to produce a smart card.
4 more elements
A method for making a contact type smart card comprising a top layer in which an electrical sensor device resides, a core layer and a bottom layer, said method comprising:
- (1) coating a layer of primer and/or adhesive on underside of the electrical sensor device such that said layer of primer/adhesive will come into direct physical contact with a thermosetting polymeric material that forms the core layer of the smart card;
- (2) positioning the electrical sensor device in an opening in top layer;
- (3) positioning the top layer and bottom layer in a mold set up that defines a void space between the top layer and the bottom layer;
- (4) injecting a thermosetting polymeric material into the void space under conditions which are such that:
- (a) the primer/adhesive comes into direct physical contact with the thermosetting polymeric material, (b) at least one layer of the smart card is at least partially cold, low pressure molded into a cavity in the top mold, (c) gases and excess polymeric material are driven out of the void space, (d) the electronic component is encapsulated in the thermosetting polymeric material before the partially cured glue becomes completely cured and (e) the thermosetting polymeric material bonds with both the top layer and the bottom layer to produce a unified precursor smart card body;
- (5) removing the unified precursor smart card body from the mold device;
- and
- (6) trimming the precursor smart card to a desired dimension to produce a smart card.
5 more elements
A method for making a contact type smart card comprising a top layer in which an electrical sensing device resides, a core layer and a bottom layer, said process comprising:
- (1) providing the electrical sensor device with at least one anchor device that will come into direct physical contact with a thermosetting polymeric material that forms the core layers of the smart card;
- (2) positioning the electrical sensor device in an opening in the top layer;
- (3) positioning the top layer and bottom layer in a mold set up that defines a void space between the top layer and the bottom layer;
- (4) injecting a thermosetting polymeric material into the void space under conditions such that the anchor device comes into direct physical contact with the thermosetting polymeric material and form a unified precursor smart card body;
- (5) removing the unified precursor smart card body from the mold set up;
- and
- (6) trimming the precursor smart card to a desired dimension to produce a smart card.
4 more elements
A method for making a contact type smart card comprising a top layer in which an electrical sensor device resides, a core layer and a bottom layer, said method comprising:
- (1) providing the electrical sensor device with a least one anchor device that will come into direct physical contact with a thermosetting polymeric material that forms the core layer of the smart card;
- (2) positioning the electrical sensor device in an opening in top layer;
- (3) positioning the top layer and bottom layer in a mold set up that defines a void space between the top layer and the bottom layer;
- (4) injecting a thermosetting polymeric material into the void space under conditions which are such that:
- (a) the anchor device comes into direct physical contact with the thermosetting polymeric material, (b) at least one layer of the smart card is at least partially cold, low pressure molded into a cavity in the top mold, (c) gases and excess polymeric material are driven out of the void space, (d) the electronic component is encapsulated in the thermosetting polymeric material before the partially cured glue becomes completely cured and (e) the thermosetting polymeric material bonds with both the top layer and the bottom layer to produce a unified precursor smart card body;
- (5) removing the unified precursor smart card body from the mold device;
- and
- (6) trimming the precursor smart card to a desired dimension to produce a smart card.
5 more elements
Dependencies are inferred from the claim text.