B29C 2045/2712
Serial gates for moulding articles in successively filled serial mould cavities
Official title: {Serial gates for moulding articles in successively filled serial mould cavities}
B29C2045/2712 (Serial gates for moulding articles in successively filled serial mould cavities) appears on 38 US grants and 40 published applications in this corpus.
Search patents in B29C- Granted patents
- 38
- Published applications
- 40
- Assignees
- 15
- Inventors
- 51
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 1 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 2 |
| 2013 | 0 | 1 |
| 2014 | 0 | 4 |
| 2015 | 4 | 6 |
| 2016 | 2 | 3 |
| 2017 | 8 | 10 |
| 2018 | 5 | 3 |
| 2019 | 4 | 5 |
| 2020 | 1 | 1 |
| 2021 | 4 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device24 Feb 2026US 12,564,088 B2Kabushiki Kaisha Toshiba
- Injection molding flow control apparatus and method30 Nov 2021US 11,186,022 B2Synventive Molding Solutions, Inc.
- Injection molding flow control apparatus and method19 Oct 2021US 11,148,335 B2Synventive Molding Solutions, Inc.
- Injection molding flow control apparatus and method10 Aug 2021US 11,084,196 B2Synventive Molding Solutions, Inc.
- Injection molding flow control apparatus and method20 Jul 2021US 11,065,793 B2Synventive Molding Solutions, Inc.
- Semiconductor device23 Mar 2023US 2023/0090448 A1Kabushiki Kaisha Toshiba
- Injection molding flow control apparatus and method9 Apr 2020US 2020/0108537 A1Synventive Molding Solutions, Inc.
- Injection molding flow control apparatus and method12 Sep 2019US 2019/0275719 A1Synventive Molding Solutions, Inc.
- Injection molding flow control apparatus and method27 Jun 2019US 2019/0193316 A1Synventive Molding Solutions, Inc.
- Injection molding flow control apparatus and method20 Jun 2019US 2019/0184616 A1Synventive Molding Solutions, Inc.
Most cited
By later US patents
- Method and apparatus for encapsulating semi-conductors23US 4,900,501 AHitachi, Ltd. · 1990
- Method of producing semiconductor devices14US 4,946,633 AHitachi, Ltd. · 1990
- Resin encapsulating apparatus for semiconductor devices13US 4,983,110 AHitachi, Ltd. · 1991
- Flow control apparatus and method9US 9,908,273 B2Synventive Molding Solutions, Inc. · 2018
- Edge-gated injection molding apparatus8US 8,932,046 B2Mold-Masters (2007) Limited · 2015