Semiconductor device

A semiconductor device, comprising:

• a die pad;
• a semiconductor chip fixed on the die pad;
• a lead portion electrically connected to the semiconductor chip;
• and
• a sealing resin covering the semiconductor chip and at least a part of the die pad, the sealing resin including a first side surface, a second side surface, a bottom surface, and a top surface, the second side surface facing the first side surface in a first direction, the top surface facing the bottom surface in a second direction, the sealing resin including at least one first protruding portion provided on a side of the first side surface and at least one second protruding portion provided on a side of the second side surface, a cross-sectional area of the at least one first protruding portion on a cross section perpendicular to the first direction being equal to or more than 10% of a maximum cross-sectional area of the sealing resin on a cross section perpendicular to the first direction, a cross-sectional area of the at least one second protruding portion on a cross section perpendicular to the first direction being equal to or more than 10% of the maximum cross-sectional area, and the maximum cross-sectional area of the sealing resin being equal to or more than 6 mm2,
• wherein the at least one first protruding portion and the at least one second protruding portion do not include the lead portion,
• the at least one first protruding portion and the at least one second protruding portion are not in contact with the lead portion,
• a bottom surface of the die pad is exposed at the bottom surface of the sealing resin,
• a bottom surface of the lead portion is exposed at the bottom surface of the sealing resin, and
• the bottom surface of the die pad and the bottom surface of the lead portion are substantially in a same plane.