Method of producing semiconductor devices

A method of producing semiconductor devices, said method comprising the steps of:

• providing a mold having a plurality of pots for supplying a molding resin;
• communicating said pots with each other by communication passages;
• providing groups of cavities in the mold with each group of cavities including at least three cavities connected in series and arranged to receive resin from one of the pots whereby resin is fed from an associated pot successively into the respective cavities;
• placing a lead frame in said mold over said cavities;
• supplying said pots with said molding resin;
• injecting said molding resin into said cavities by pressing said resin in said pots by a plurality of plungers;
• and
• providing a dummy cavity connected to a most downstream cavity of each group for receiving excess resin therefrom.

A method for producing semiconductor devices, said method comprising the steps of:

• providing a mold having a plurality of pots for supplying a molding resin;
• communicating said pots with each other by communication passages;
• providing groups of cavities in the mold with each group of cavities comprising a plurality of cavities arranged in series to receive the resin from one of said pots;
• placing a lead frame in said mold over said cavity;
• supplying said pots with said molding resin;
• injecting said molding resin into said cavities by pressing said resin into said pots by a plurality of plungers;
• connecting the cavities of each group of cavities with each other by runners acting as passages from an associated pot and through which passage the resin is fed from the pot into the cavities of the group of cavities;
• and
• providing air vents connected to said communication passages to allow air to escape through said air vent from the resin in said communication passages.

A method of producing semiconductor devices, said method comprising the steps of:

• providing a mold having a plurality of pots for supplying a molding resin;
• communicating said pots with each other by communication passages;
• providing groups of cavities in the mold with each group of cavities comprising a plurality of cavities arranged in series to receive the resin from one of said pots;
• placing a lead frame in said mold over said cavity said lead frame including a plurality of tabs arranged in longitudinal and lateral directions of said lead frame to support semiconductor devices thereon;
• providing slits between semiconductor devices;
• and
• injecting said molding resin into said cavities by pressing said molding resin in said pots by a plurality of plungers through said slits with the semiconductor devices formed on said tabs.

A method of producing semiconductor devices, said method comprising the steps of:

• providing a mold having a plurality of pots for supplying a molding resin;
• communicating said pots with each other by communication passages;
• providing groups of cavities in the mold with each group of cavities comprising a plurality of cavities arranged in series to receive the resin from one of said pots;
• placing a lead frame in said mold over said cavity;
• supplying said pots with said molding resin;
• injecting said molding resin into said cavities by pressing said resin in said pots by a plurality of plungers;
• providing resin discharge slits for allowing the molding resin from downstream semiconductor devices to be discharged;
• and
• wherein the step of injecting said molding resin is effected in such a manner that the molding resin reaches and flows through the resin discharge slits.

A method of producing semiconductor devices, said method comprising the steps of:

• providing a mold having a plurality of pots for supplying a molding resin;
• communicating said pots with each other by communication passages;
• providing groups of cavities in the mold with each group of cavities comprising a plurality of cavities arranged in series to receive the resin from one of said pots, said cavities being arranged such that apexes of each adjacent pair of cavities are connected by a runner;
• and
• injecting said molding resin into said cavities by pressing said resin in said pots by a plurality of plungers in such a manner that the molding resin flows through the runner.

A method of producing semiconductor devices, said method comprising the steps of:

• providing a mold having a plurality of pots for supplying a molding resin;
• communicating said pots with each other by communication passages;
• providing groups of cavities in the mold with each group of cavities comprising a plurality of cavities arranged in series to receive the resin from one of said pots;
• placing a lead frame in said mold over said cavity;
• supplying said pots with said molding resin;
• and
• injecting said molding resin into said cavities by pressing said resin in said pot by a plurality of plungers by:
• providing a plurality of plungers connected to a rod of the molding machine to a rigid plate means,
• downwardly driving the rod to simultaneously drive said plungers to force the molding resin out of said pots,
• moving said rod through a speed control to a predetermined position;
• changing the speed control movement of the rod to a load control of the rod, and
• injecting the molding resin by operation of a driving mechanism.

The method of producing semiconductor devices, the method comprising the steps of:

• providing a mold having a plurality of pots for supplying molding resin;
• communicating said pots with each other by communication passages;
• providing runners for allowing the molding resin to flow from said communication passages;
• providing groups of cavities in said mold with each group comprising a plurality of cavities arranged in series to an associated runner to receive the molding resin therefrom;
• placing a lead frame in said mold;
• supplying said pots with said molding resin;
• and
• injecting said molding resin through said communication passages and said runners into said cavities by pressing said resin in said pots by a plurality of plungers.