Resin encapsulating apparatus for semiconductor devices
AssigneeHitachi, Ltd.
InventorsIsamu Yoshida, Junichi Saeki, Shigeharu Tsunoda, Kunihiko Nishi, Masao Mitani
Life of this patent
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Abstract
A resin encapsulating apparatus for semiconductor devices is characterized by including a rectangular pot constituted by being surrounded with two opposed wall surfaces of short side each having an outwardly projecting curved surface and two opposed wall surfaces of long side which are each substantially in the form of a straight line; a plurality of cavity lines connected respectively through gates to the bottom portion of at least one said long-side wall surface of the pot, the cavity lines each consisting of cavities connected in series; and a plunger to be inserted into the pot.
Claims7
A resin encapsulating apparatus for semiconductor devices, including:
- a rectangular pot for receiving an encapsulating resin comprising two opposed wall surfaces of short side each having an outwardly projecting curved surface, and two opposed wall surfaces of long side substantially in the form of a straight line;
- a plurality of cavity lines and gates connected respectively to the bottom portion of at least one of said long-side wall surfaces of said pot, said cavity lines comprising cavities connected in series through the gate;
- and,
- a plunger to be inserted into said pot whereby resin may be urged by the plunger from the pot to the cavities through the gate to encapsulate semiconductor devices disposed in the cavities.
A resin encapsulating apparatus for semiconductor devices, including:
- a first mold having a rectangular pot formed therein, said rectangular pot being constituted by being surrounded with two opposed wall surfaces of short side each having an outwardly projecting curved surface and two opposed wall surfaces of long side which are each in the form of a straight line;
- a second mold having plurally divided cylinders disposed therein at predetermined intervals in positions opposed to the pot surfaces in the first mold;
- a plurality of plungers inserted respectively into said cylinders;
- a rod for actuating said plungers simultaneously vertically;
- and
- a plurality of gates for the transfer of resin connected each independently to the bottom portion of at least one of said long-side wall surface of said pot, and a plurality of cavity lines connected respectively through said gates to said bottom portion, said cavity lines each consisting of cavities connected in series.
A resin encapsulating apparatus for semiconductor devices, including:
- a first mold wherein there is formed a rectangular pot portion surrounded with two opposed wall surfaces of short side each having an outwardly projecting curved surface and two opposed wall surfaces of long side which are each in the for of a straight line, plurally divided cylinders are disposed at predetermined intervals in the back of said pot portion, a plurality of plungers are inserted respectively into said cylinders, a plurality of gates for the transfer of resin connected each independently to at least one of said long-side wall surfaces of said pot, and a plurality of cavity lines connected respectively through said gates to said long-side wall surface, said cavity lines each consisting of cavities connected in series;
- a second mold opposed to said first mold;
- and
- a rod for actuating said plungers in said cylinders simultaneously vertically.
Dependencies are inferred from the claim text.