B26F 2210/08
Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific
Official title: of ceramic green sheets, printed circuit boards and the like
B26F2210/08 (Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific) appears on 84 US grants and 28 published applications in this corpus.
Search patents in B26F- Granted patents
- 84
- Published applications
- 28
- Assignees
- 38
- Inventors
- 143
- Latest grant
- 11 Apr 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 6 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 6 | 0 |
| 2000 | 4 | 0 |
| 2001 | 9 | 2 |
| 2002 | 7 | 7 |
| 2003 | 7 | 6 |
| 2004 | 4 | 3 |
| 2005 | 4 | 2 |
| 2006 | 0 | 4 |
| 2007 | 0 | 2 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Resin sheet producing method, optical member produced by resin sheet producing method, area light source device in which optical member is used, liquid crystal display device, and mobile device11 Apr 2017US 9,618,180 B2OMRON Corporation
- Stamping device for generally flat articles1 Jun 2010US 7,726,553 B2Groz-Beckert KG
- Method of forming blind holes in a sheet of material13 May 2008US 7,370,505 B2Metalform Asia Pte Ltd.
- Punch die for punching and laminating simultaneously12 Jul 2005US 6,915,828 B2NGK Insulators, Ltd.
- Multilayer board having precise perforations and circuit substrate having precise through-holes17 May 2005US 6,894,888 B2NGK Insulators, Ltd.
- Marking device and electrode sheet production system26 Dec 2024US 2024/0424707 A1Contemporary Amperex Technology (Hong Kong) Limited
- Resin sheet producing method, optical member produced by resin sheet producing method, area light source device in which optical member is used, liquid crystal display device, and mobile device8 May 2014US 2014/0125921 A1OMRON Corporation
- Through-hole machining apparatus of green sheet and through-hole machining method of the same18 Oct 2007US 2007/0240814 A1Alps Electric Co., Ltd.
- Method and structure to enable fine grid mlc technology26 Jul 2007US 2007/0169600 A1International Business Machines Corporation
- Cutting apparatus for ceramic green sheet and cutting method for same5 Oct 2006US 2006/0219070 A1TDK Corporation
Most cited
By later US patents
- Programmable magnetic repulsion punching apparatus44US 4,821,614 AInternational Business Machines Corporation · 1989
- Punching apparatus for stamping and method for producing the same37US 6,408,728 B1NGK Insulators, Ltd. · 2002
- Programmable magnetic repulsion punching apparatus33US 4,872,381 AInternational Business Machines Corporation · 1989
- Punching apparatus29US 5,214,991 AHitachi, Ltd. · 1993
- Method and apparatus for aligning mating form tools27US 4,945,954 AMicroelectronics and Computer Technology Corporation · 1990