Multilayer board having precise perforations and circuit substrate having precise through-holes
AssigneeNGK Insulators, Ltd.
InventorsYukihisa Takeuchi, Hiroyuki Tsuji, Kazumasa Kitamura, Yoshinori Yamaguchi
Life of this patent
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Abstract
An intermediate laminated structure is provided including a plurality of unfired ceramic plates stacked along a laminating direction. Each of the plates has a plurality of holes formed therethrough by a punching operation. At least a first hole in one of the plurality of unfired ceramic plates has the same shape and cross-sectional area as respective first holes in the remaining plurality of unfired ceramic plates such that the first holes define a cylinder of constant cross-sectional area throughout the entire thickness of the intermediate laminated structure.
Claims20
An intermediate laminated structure comprising a plurality of unfired ceramic plates stacked along a laminating direction, each of said plates having a plurality of holes formed therethrough by a punching operation, wherein at least a first hole in one of said plurality of unfired ceramic plates has the same shape and cross-sectional area as respective first holes in the remaining plurality of unfired ceramic plates such that said first holes define a cylinder of constant cross-sectional area throughout the entire thickness of said intermediate laminated structure.
An intermediate laminated structure comprising a plurality of unfired ceramic plates stacked along a laminating direction, each of said plates having a plurality of holes formed therethrough by a punching operation;
- wherein at least a first hole in one of said plurality of unfired ceramic plates has the same shape and cross-sectional area as respective first holes in the remaining plurality of unfired ceramic plates such that said first holes define a cylinder of constant cross-sectional area throughout the entire thickness of said intermediate laminated structure;
- and
- wherein said unfired ceramic plates have a Young's modulus of 3000 kgf/mm2 or less and a tensile strength of 20 kgf/mm2 or less.
An intermediate laminated structure comprising a plurality of unfired ceramic plates stacked along a laminating direction, each of said plates having a plurality of holes formed therethrough by a punching operation, wherein at least a first hole in one of said plurality of unfired ceramic plates has the same shape and cross-sectional area as respective first holes in the remaining plurality of unfired ceramic plates such that said first holes define a cylinder of constant cross-sectional area throughout the entire thickness of said intermediate laminated structure,
- wherein said intermediate laminated structure is fabricated by a method comprising the steps of:
- providing a punching machine comprising at least one punch, a die, and a stripper;
- providing a predetermined number of said unfired ceramic plates;
- forming at least a first hole in a first unfired ceramic plate with said punch and pulling up said first unfired ceramic plate by closely attaching said first unfired ceramic plate to said stripper while leaving said punch in said first hole;
- forming at least a first hole in a second unfired ceramic plate with said punch and pulling up said second unfired ceramic plate together with said first unfired ceramic plate while leaving said punch in said second hole;
- and
- forming first holes in the remaining unfired ceramic plates and sequentially stacking the punched unfired ceramic plates along said punch as a stacking axis.
An intermediate laminated circuit substrate comprising:
- a plurality of insulators comprising unfired ceramic plates;
- and
- a plurality of conductors formed on said insulators;
- and
- at least one cylinder defined by a plurality of first holes formed in each of said insulators and conductors by a punching operation and passing through all of said insulators and conductors, wherein at least a first hole in one of said plurality of insulators and conductors has the same shape and cross-sectional area as respective first holes in the remaining plurality of insulators and conductors such that said cylinder has a constant cross-sectional area throughout the entire thickness of said intermediate laminated circuit substrate.
An intermediate laminated circuit substrate comprising:
- a plurality of conductors, a plurality of insulators for insulating said conductors stacked together with said conductors, said insulators comprising unfired ceramic plates, and at least one cylinder defined by a plurality of first holes formed in each of said insulators and conductors by a punching operation and passing through all of said insulators and conductors, wherein at least a first hole in one of said plurality of insulators and conductors has the same shape and cross-sectional area as respective first holes in the remaining plurality of said insulators and conductors such that said cylinder has a constant cross-sectional area throughout the entire thickness of said intermediate laminated circuit substrate,
- wherein said intermediate laminated circuit substrate is fabricated by a method comprising the steps of:
- providing a punching machine comprising at least one punch, a die, and a stripper;
- providing a plurality of wiring boards comprising an insulating unfired ceramic material and having respective circuits formed thereon;
- forming at least a first hole in a first wiring board with said punch and pulling up said first wiring board by closely attaching said first wiring board to said stripper while leaving said punch in said first hole of said first wiring board;
- forming at least a first hole in a second wiring board with said punch and pulling up said second wiring board together with said first wiring board while leaving said punch in said first hole of said second wiring board;
- and
- forming first holes in the remaining wiring boards and sequentially stacking the punched wiring boards along said punch as a stacking axis.
An intermediate laminated circuit substrate comprising:
- a base substrate comprising a plurality of conductors, a plurality of insulators for insulating said conductors stacked together with said conductors, said insulators comprising unfired ceramic plates, and at least one cylinder defined by a plurality of first holes formed in each of said insulators and conductors by a punching operation and passing through all of said insulators and conductors, wherein at least a first hole in one of said plurality of insulators and conductors has the same shape and cross-sectional area as respective first holes in the remaining plurality of said insulators and conductors such that said cylinder has a constant cross-sectional area throughout the entire thickness of said intermediate laminated circuit substrate;
- and
- at least one build-up layer formed on at least one side of said base substrate, said build-up layer comprising at least one conducting layer and at least one insulating layer alternately stacked together with said conducting layer.
An intermediate laminated circuit substrate comprising:
- a base substrate comprising a plurality of conductors, a plurality of insulators for insulating said conductors stacked together with said conductors, said insulators comprising unfired ceramic plates, and at least one cylinder defined by a plurality of first holes formed in each of said insulators and conductors by a punching operation and passing through all of said insulators and conductors, wherein at least a first hole in one of said plurality of insulators and conductors has the same shape and cross-sectional area as respective first holes in the remaining plurality of said insulators and conductors such that said cylinder has a constant cross-sectional area throughout the entire thickness of said intermediate laminated circuit substrate, and
- at least one build-up layer formed on at least one side of said base substrate, said build-up layer comprising at least one conducting layer and at least one insulating layer alternately stacked together with said conducting layer,
- wherein said intermediate laminated circuit substrate is fabricated by a method comprising the steps of:
- providing a punching machine comprising at least one punch, a die, and a stripper;
- providing a plurality of wiring boards comprising an insulating unfired ceramic material and having respective circuits formed thereon;
- forming a first hole in a first wiring board with said punch and pulling up said first wiring board by closely attaching said first wiring board to said stripper while leaving said punch in said first hole of said first wiring board;
- forming a first hole in a second wiring board with said punch and pulling up said second wiring board together with said first wiring board while leaving said punch in said first hole of said second wiring board;
- forming first holes in the remaining wiring boards and sequentially stacking said punched wiring boards along said punch as a stacking axis to form said base substrate;
- and
- forming said build-up layer on said base substrate.
Dependencies are inferred from the claim text.