Method and structure to enable fine grid mlc technology

A method of forming openings in a substrate comprising:

• providing a substrate;
• positioning said substrate between a punch and a die set;
• punching a first via through said substrate, said first via being plagued by via distortion;
• punching a second via through said substrate, said second via overlapping said first via so as to remove a first portion of said via distortion;
• and
• punching a third via through said substrate on an opposite side of said first via as compared to said second via, said third via overlapping at least said first via and removing a second portion of said via distortion,
• whereby said first, second and third vias together form a single extended via within said substrate.

An intermediate substrate product comprising:

• a substrate having a substantially planar and rigid body;
• a first via traversing through said substrate body;
• a second via traversing through said substrate body and overlapping said first via;
• and
• a third via traversing through said substrate body and at least overlapping said first via, said second and third vias residing on opposite sides of said first via,
• whereby said first, second and third vias together form a single extended via within said substrate.