B24B 51/00
Arrangements for automatic control of a series of individual steps in grinding
Official title: Arrangements for automatic control of a series of individual steps in grinding a workpiece (if applicable to other machine tools, G05B takes precedence)
B24B51/00 (Arrangements for automatic control of a series of individual steps in grinding) appears on 499 US grants and 540 published applications in this corpus.
Search patents in B24B- Granted patents
- 499
- Published applications
- 540
- Assignees
- 304
- Inventors
- 1,234
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 5 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 4 | 0 |
| 1996 | 7 | 0 |
| 1997 | 10 | 0 |
| 1998 | 7 | 0 |
| 1999 | 16 | 0 |
| 2000 | 11 | 0 |
| 2001 | 23 | 11 |
| 2002 | 16 | 10 |
| 2003 | 16 | 19 |
| 2004 | 15 | 19 |
| 2005 | 24 | 16 |
| 2006 | 21 | 15 |
| 2007 | 11 | 16 |
| 2008 | 12 | 17 |
| 2009 | 8 | 8 |
| 2010 | 7 | 8 |
| 2011 | 7 | 9 |
| 2012 | 7 | 13 |
| 2013 | 7 | 7 |
| 2014 | 12 | 23 |
| 2015 | 14 | 8 |
| 2016 | 9 | 9 |
| 2017 | 8 | 19 |
| 2018 | 18 | 20 |
| 2019 | 13 | 17 |
| 2020 | 10 | 27 |
| 2021 | 13 | 35 |
| 2022 | 15 | 40 |
| 2023 | 24 | 44 |
| 2024 | 35 | 62 |
| 2025 | 34 | 43 |
| 2026 | 32 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- System and method for controlling chemical mechanical planarization29 Sep 2026US 12,751,254 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Thermal imaging surface processing auxiliary system and method22 Sep 2026US 12,741,356 B2Industrial Technology Research Institute
- Multi-pattern in-pad surface for polish rate control22 Sep 2026US 12,741,357 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing method and polishing apparatus1 Oct 2026US 2026/0295763 A1Ebara Corporation
- Zone-based cmp target control1 Oct 2026US 2026/0295766 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Workpiece processing method and semiconductor device manufacturing method24 Sep 2026US 2026/0293562 A1Disco Corporation
- Flexible finishing station for brake pads and method thereof27 Aug 2026US 2026/0249414 A1ITT Italia S.r.l.
- Abrasive articles, systems and methods of use27 Aug 2026US 2026/0249424 A13M Innovative Properties Company
Most cited
By later US patents
- Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus396US 5,893,796 AAPPLIED Materials.Inc. · 1999
- Apparatus and method for in-situ monitoring of chemical mechanical polishing operations261US 5,964,643 AAPPLIED Materials.Inc. · 1999
- Wafer polishing method and apparatus209US 5,329,732 ASpeedfam Corporation · 1994
- Mirror assembly for vehicle178US 8,508,831 B2Magna Mirrors of America, Inc. · 2013
- Wafer polishing method and apparatus157US 5,498,199 ASpeedfam Corporation · 1996