B24B 49/105
Using eddy currents
Official title: {using eddy currents}
B24B49/105 (Using eddy currents) appears on 193 US grants and 221 published applications in this corpus.
Search patents in B24B- Granted patents
- 193
- Published applications
- 221
- Assignees
- 72
- Inventors
- 376
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 10 |
| 2004 | 3 | 8 |
| 2005 | 7 | 11 |
| 2006 | 18 | 12 |
| 2007 | 9 | 6 |
| 2008 | 4 | 9 |
| 2009 | 6 | 9 |
| 2010 | 6 | 7 |
| 2011 | 5 | 10 |
| 2012 | 6 | 10 |
| 2013 | 6 | 10 |
| 2014 | 5 | 9 |
| 2015 | 10 | 16 |
| 2016 | 12 | 9 |
| 2017 | 7 | 5 |
| 2018 | 7 | 8 |
| 2019 | 4 | 15 |
| 2020 | 7 | 5 |
| 2021 | 3 | 11 |
| 2022 | 4 | 2 |
| 2023 | 15 | 5 |
| 2024 | 9 | 14 |
| 2025 | 4 | 11 |
| 2026 | 4 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for detection of wafer slippage11 Aug 2026US 12,703,057 B2APPLIED Materials.Inc.
- Output signal processing device for eddy-current sensor16 Jun 2026US 12,656,097 B2Ebara Corporation
- Pad conditioner cut rate monitoring17 Mar 2026US 12,576,476 B2APPLIED Materials.Inc.
- Profile control during polishing of a stack of adjacent conductive layers24 Feb 2026US 12,558,756 B2APPLIED Materials.Inc.
- Polishing apparatus and polishing method16 Dec 2025US 12,496,677 B2Ebara Corporation
- Grinding stone truing method and truing device20 Aug 2026US 2026/0241514 A1Tokyo Seimitsu Co., Ltd.
- Device and method for truing grinding stone13 Aug 2026US 2026/0233359 A1Tokyo Seimitsu Co., Ltd.
- Substrate polishing apparatus and film thickness calculating method2 Jul 2026US 2026/0183892 A1Ebara Corporation
- Polishing apparatus25 Jun 2026US 2026/0175349 A1Ebara Corporation
- Polishing apparatus and polishing method12 Mar 2026US 2026/0070181 A1Ebara Corporation
Most cited
By later US patents
- Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization282US 7,115,017 B1Novellus Systems, Inc. · 2006
- Vaporizer using electrical induction to produce heat70US 6,734,405 B2STERIS Inc. · 2004
- Eddy current system for in-situ profile measurement66US 7,112,960 B2APPLIED Materials.Inc. · 2006
- Determination of position of sensor measurements during polishing56US 7,097,537 B1APPLIED Materials.Inc. · 2006
- Method and apparatus for monitoring a metal layer during chemical mechanical polishing51US 6,924,641 B1APPLIED Materials.Inc. · 2005