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US 6,924,641 B1Granted
Method and apparatus for monitoring a metal layer during chemical mechanical polishing
AssigneeApplied Materials, Inc.
InventorsHiroji Hanawa, Nils Johansson, Boguslaw Swedek, Manoocher Birang
Life of this patent
Estimating the term…
Abstract
A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.
Claims28
A chemical mechanical polishing apparatus, comprising:
- a polishing pad;
- a carrier to hold a substrate against a polishing surface of the polishing pad;
- a sensor for monitoring a conductive film in a substrate, the sensor including a core positionable in proximity to the substrate, a first coil wound around a first portion of the core, an oscillator electrically coupled to the first coil to induce an alternating current in the first coil and generate an alternating magnetic field in proximity to the substrate, a second coil wound around a second portion of the core, a capacitor electrically coupled to the second coil, and an amplifier electrically coupled to the second coil and the capacitor to generate an output signal, wherein the oscillator induces an alternating current with a substantially constant frequency selected to provide a resonant frequency when the substrate is not in proximity to the core;
- a motor coupled to at least one of the polishing pad and carrier head for generating relative motion therebetween;
- and
- a computer to receive and monitor the output signal from the sensor while the substrate contacts the polishing pad and the oscillator induces the alternating current with the substantially constant frequency.
3 more elements
A chemical mechanical polishing apparatus, comprising:
- a polishing pad having a polishing surface;
- a carrier to hold a substrate against the polishing surface;
- an eddy current sensor including at least one inductor, an oscillator electrically coupled to the at least one inductor to induce an alternating current in the at least one inductor and generate an alternating magnetic field, and a capacitor electrically coupled to the at least one inductor;
- a motor coupled to at least one of the polishing pad and carrier head for generating relative motion therebetween;
- and
- a platen to support the polishing pad, and wherein the platen rotates, and further comprising a position sensor to determine an angular position of the platen and a controller to sample data from the eddy current sensor when the at least one inductor is positioned adjacent the substrate.
3 more elements
A chemical mechanical polishing apparatus, comprising:
- a polishing pad having a polishing surface;
- a carrier to hold a substrate against the polishing surface;
- an eddy current sensor including a core, at least one inductor positioned on a side of the polishing surface opposite the substrate, the at least one inductor including a first inductor wound around a first portion of the core and a second inductor wound around a second portion of the core, an oscillator electrically coupled to the at least one inductor to induce an alternating current in the at least one inductor and generate an alternating magnetic field, and a capacitor electrically coupled to the at least one inductor;
- and
- a motor coupled to at least one of the polishing pad and carrier head for generating relative motion therebetween, wherein the oscillator is electrically coupled to the first inductor to induce an alternating current in the first inductor, and wherein the capacitor is electrically coupled to the second coil.
2 more elements
A chemical mechanical polishing apparatus, comprising:
- a polishing pad;
- a carrier to hold a substrate against a polishing surface of the polishing pad on the support;
- an eddy current sensor including at least one inductor positioned to be on a side of the polishing surface opposite the substrate when the polishing pad is on the support, an oscillator electrically coupled to the at least one inductor to induce an alternating current in the coil at least one inductor and generate an alternating magnetic field;
- a motor coupled to at least one of the support and the carrier head for generating relative motion therebetween;
- and
- further comprising a position sensor to determine an angular position of the platen and a controller to sample data from the eddy current sensor when the at least one inductor is positioned adjacent the substrate.
3 more elements
Dependencies are inferred from the claim text.