B23K 35/302
Cu as the principal constituent
Official title: {Cu as the principal constituent}
B23K35/302 (Cu as the principal constituent) appears on 563 US grants and 640 published applications in this corpus.
Search patents in B23K- Granted patents
- 563
- Published applications
- 640
- Assignees
- 366
- Inventors
- 1,446
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 8 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 12 | 0 |
| 1985 | 11 | 0 |
| 1986 | 13 | 0 |
| 1987 | 9 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 10 | 0 |
| 1991 | 6 | 0 |
| 1992 | 9 | 0 |
| 1993 | 5 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 5 | 3 |
| 2002 | 2 | 6 |
| 2003 | 6 | 9 |
| 2004 | 7 | 11 |
| 2005 | 1 | 12 |
| 2006 | 3 | 12 |
| 2007 | 6 | 17 |
| 2008 | 7 | 6 |
| 2009 | 9 | 15 |
| 2010 | 6 | 19 |
| 2011 | 11 | 14 |
| 2012 | 9 | 21 |
| 2013 | 13 | 27 |
| 2014 | 14 | 44 |
| 2015 | 16 | 40 |
| 2016 | 21 | 50 |
| 2017 | 35 | 56 |
| 2018 | 38 | 54 |
| 2019 | 47 | 28 |
| 2020 | 37 | 32 |
| 2021 | 28 | 27 |
| 2022 | 16 | 23 |
| 2023 | 23 | 33 |
| 2024 | 30 | 27 |
| 2025 | 22 | 36 |
| 2026 | 8 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Copper-tin-nickel brazing material prepared by alloys recycled from E-waste, preparation method therefor and system thereof15 Sep 2026US 12,735,765 B2Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
- Active metal brazing substrate and method for manufacturing the same1 Sep 2026US 12,722,359 B2Tong Hsing Electronic Industries, Ltd.
- Method for manufacturing an electrical conductor, such as a current rod, for a high-temperature electrochemical device11 Aug 2026US 12,706,315 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Metal-ceramic substrate, method for the production thereof, and module28 Jul 2026US 12,692,202 B2Heraeus Electronics GmbH & Co. KG
- Flux-coated ball and method for manufacturing same26 May 2026US 12,636,737 B2Senju Metal Industry Co., Ltd.
- Copper microparticle dispersion10 Sep 2026US 2026/0264178 A1Kao Corporation
- Bonding sheet, method for producing bonding sheet, and method for producing bonded body3 Sep 2026US 2026/0257304 A1Mitsubishi Materials Corporation
- Metal matrix composite materials and methods of manufacturing thereof20 Aug 2026US 2026/0242903 A1Epos Technologies Limited
- Copper Bonding Wire, Method for Manufacturing Copper Bonding Wire, and Semiconductor Device30 Jul 2026US 2026/0216830 A1TANAKA ELECTRONICS Co., Ltd.
- Wear-resistant brazing filler metal, preparation method and use thereof4 Jun 2026US 2026/0151862 A1China Academy of Machinery Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
Most cited
By later US patents
- Semiconductor electrical heater and method for making same354US 5,498,850 APhilip Morris Incorporated · 1996
- Selective laser sintering of parts by compound formation of precursor powders280US 5,156,697 ABoard of Regents, The University of Texas System · 1992
- Semiconductor electrical heater and method for making same189US 5,659,656 APhilip Morris Incorporated · 1997
- Method of soldering or welding components117US 8,686,314 B2FFT EDAG Produktionssysteme GmbH & Co. KG · 2014
- Brazing-filler material and method for brazing diamond107US 6,889,890 B2Hohoemi Brains, Inc. · 2005