B23H 5/10
Electrodes specially adapted therefor or their manufacture
Official title: Electrodes specially adapted therefor or their manufacture (B23H1/04, B23H3/04 take precedence)
B23H5/10 (Electrodes specially adapted therefor or their manufacture) appears on 22 US grants and 27 published applications in this corpus.
Search patents in B23H- Granted patents
- 22
- Published applications
- 27
- Assignees
- 16
- Inventors
- 71
- Latest grant
- 28 May 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 3 |
| 2004 | 0 | 6 |
| 2005 | 1 | 3 |
| 2006 | 5 | 1 |
| 2007 | 3 | 2 |
| 2008 | 4 | 3 |
| 2009 | 0 | 1 |
| 2010 | 1 | 2 |
| 2011 | 2 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 2 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials28 May 2024US 11,992,890 B2Changsha University of Science and Technology
- Method for removing material from a component, and electrode9 Feb 2016US 9,254,530 B2MTU Aero Engines AG
- Grinding/electrolysis combined multi-wire-slicing processing method for silicon wafers10 Jun 2014US 8,747,625 B2Nanjing University of Aeronautics and Astronautics
- Electrochemical and mechanical polishing and shaping method and system8 Nov 2011US 8,052,860 B1The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
- Apparatus and method for hybrid machining a contoured, thin-walled workpiece12 Jul 2011US 7,976,694 B2General Electric Company
- System and method of thinning wafer substrate16 Jan 2025US 2025/0018486 A1CompTake Technology Inc.
- Electrochemical Discharge-assisted Micro-grinding Device for Micro-components of Brittle and Hard Materials12 Oct 2023US 2023/0321740 A1Changsha University of Science and Technology
- Electrolysis and grinding combined machining device and method16 Dec 2021US 2021/0387274 A1Jiangxi University of Science and Technology
- Dual cathode tooling device for electroerosion5 Sep 2019US 2019/0270153 A1La Corporacion Mexicana De Investigacion En Materiales, S.A. De C.V.
- Two-fluid device for electroerosion5 Sep 2019US 2019/0270154 A1La Corporacion Mexicana De Investigacion En Materiales, S.A. De C.V.
Most cited
By later US patents
- Conductive polishing article for electrochemical mechanical polishing59US 6,962,524 B2APPLIED Materials.Inc. · 2005
- Conductive polishing article for electrochemical mechanical polishing40US 7,422,516 B2APPLIED Materials.Inc. · 2008
- Conductive polishing article for electrochemical mechanical polishing29US 7,278,911 B2APPLIED Materials.Inc. · 2007
- Conductive polishing article for electrochemical mechanical polishing25US 6,991,528 B2APPLIED Materials.Inc. · 2006
- Pad assembly for electrochemical mechanical processing16US 7,077,721 B2APPLIED Materials.Inc. · 2006