Grinding/electrolysis combined multi-wire-slicing processing method for silicon wafers

A grinding/electrolysis combined multi-wire-slicing processing method for silicon wafers, comprising:

• firstly, a metal slicing wire on a multi-wire slicing machine tool is used as a tool electrode configured as a cathode and a silicon rod or silicon ingot configured as an anode is subject to grinding/electrolysis combined slicing processing by a dedicated power input method;
• secondly, the metal slicing wire and the silicon rod or silicon ingot are externally connected to a low-voltage continuous or impulse DC power supply during the processing;
• thirdly, cutting fluid is sprayed in the slicing zone in order to meet the requirements of slurry supply or cooling, product removal and anode passivation or corrosion;
• said dedicated power input method comprises:
• a metal electrode (3) is added between the silicon rod or silicon ingot (1) and glass (2), binder (4) is used to bind the silicon rod or silicon ingot (1) and glass (2) together and realize good conductivity between the silicon rod or silicon ingot (1) and the metal electrode (3), glass (2) is mounted onto a metal layer (5) through which glass (2) is positioned and mounted to a workbench (6) in a fixed manner, an electrical insulation with a machine tool body (7) is maintained, a lead-out part of metal electrode (3) is connected to an anode of the low-voltage continuous or impulse DC power supply (9) with a cable (8), thereby realizing a connection between the silicon rod or silicon ingot (1) and the anode of low-voltage continuous or impulse DC power supply (9), a metal slicing wire (10) passes through a main wire roller (11), and a power input block (12) is connected to a cathode of low-voltage continuous or impulse DC power supply (9);
• wherein the workbench (6) laterally protrudes beyond the edges of the metal layer (5);
• and
• wherein the machine tool body (7) laterally protrudes beyond the edges of the workbench (6).