Conductive polishing article for electrochemical mechanical polishing
AssigneeApplied Materials, Inc.
InventorsPaul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev, Stan D. Tsai, Feng Q. Liu, Ralph Wadensweiler, Lizhong Sun, Siew S. Neo, Alain Duboust
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Abstract
Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.
Claims18
A polishing article for polishing a substrate, comprising:
- a ring-shaped upper layer having a polishing surface;
- and
- a conductive layer coupled to the upper layer and forming a replaceable assembly therewith, wherein a plurality of holes are formed through the upper layer exposing an upper surface of the conductive layer.
A polishing article for polishing a substrate, comprising:
- a ring-shaped upper layer having a polishing surface;
- a conductive layer coupled to the upper layer and forming a replaceable assembly therewith;
- and
- a subpad sandwiched between the upper layer and the conductive layer.
A polishing article for polishing a substrate, comprising:
- a ring-shaped upper layer having a polishing surface;
- and
- a conductive layer coupled to the upper layer and forming a replaceable assembly therewith, wherein the conductive layer is stainless steel.
A polishing article for polishing a substrate, comprising:
- a ring-shaped upper layer having a polishing surface;
- and
- a conductive layer coupled to the upper layer and forming a replaceable assembly therewith, wherein the conductive layer further comprises a plurality of independently biasable electrical zones.
A polishing article for polishing a substrate, comprising:
- a ring-shaped upper layer having a polishing surface;
- and
- a conductive layer coupled to the upper layer and forming a replaceable assembly therewith, wherein the upper layer is fabricated from a dielectric material.
A polishing article for polishing a substrate, comprising:
- a ring of non-conductive material defining a polishing surface;
- and
- a conductive layer coupled to the ring and having a terminal for coupling to a power source, wherein a first set of holes formed through the non-conductive material and exposing the conductive layer to the polishing surface.
A polishing article for polishing a substrate, comprising:
- an upper layer having a ring-shaped polishing surface;
- and
- a conductive layer coupled to the upper layer, the conductive layer having a first zone and at least a second zone, wherein a first set of holes formed through the upper layer for exposing the conductive layer to the polishing surface.
Dependencies are inferred from the claim text.