Conductive polishing article for electrochemical mechanical polishing

A polishing article for polishing a substrate, comprising:

• an upper layer having a non-conductive polishing surface;
• a subpad coupled to the upper layer opposite the polishing surface;
• a conductive layer sandwiching the subpad to the upper layer, the conductive layer having a terminal for coupling to a power source;
• a first set of holes formed through the upper layer and subpad for exposing the conductive layer to the polishing surface;
• and
• at least one aperture formed through the upper layer, the subpad and the conductive layer and adapted to receive a substrate biasing element at least partially therethrough.

A polishing article for polishing a substrate, comprising:

• an upper layer having a non-conductive polishing surface;
• a conductive layer coupled to the upper layer, the conductive layer having a first zone and at least a second zone, wherein a percentage of top surface area conductive material per zone is different between the first and second zones;
• a first set of holes formed through the upper layer for exposing the conductive layer to the polishing surface;
• and
• at least one aperture formed through the upper layer and the conductive layer and adapted to receive a substrate biasing element at least partially therethrough.