B22F 2301/10
Copper
B22F2301/10 (Copper) appears on 370 US grants and 657 published applications in this corpus.
Search patents in B22F- Granted patents
- 370
- Published applications
- 657
- Assignees
- 387
- Inventors
- 1,493
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 3 |
| 2012 | 0 | 4 |
| 2013 | 0 | 3 |
| 2014 | 2 | 4 |
| 2015 | 0 | 6 |
| 2016 | 3 | 32 |
| 2017 | 8 | 60 |
| 2018 | 18 | 75 |
| 2019 | 36 | 54 |
| 2020 | 44 | 71 |
| 2021 | 40 | 77 |
| 2022 | 47 | 59 |
| 2023 | 48 | 57 |
| 2024 | 47 | 63 |
| 2025 | 48 | 48 |
| 2026 | 29 | 40 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Copper particles and method for manufacturing same22 Sep 2026US 12,741,312 B2Mitsui Kinzoku Company, Limited
- Coating for preventing marine biofouling and preparation method thereof1 Sep 2026US 12,723,163 B2North China Electric Power University
- Method for producing film25 Aug 2026US 12,715,038 B2LG Chem.Ltd.
- Method for manufacturing copper alloy powder for metal AM25 Aug 2026US 12,715,040 B2Mitsubishi Materials Corporation
- Three-dimensional printing18 Aug 2026US 12,708,938 B2Peridot Print LLC
- Composite copper particles, method for producing same, and use of same8 Oct 2026US 2026/0307142 A1Ishihara Sangyo Kaisha, Ltd.
- Copper paste8 Oct 2026US 2026/0307143 A1Material Concept, Inc.
- Additive manufacturing polymers with high metal inclusion content8 Oct 2026US 2026/0308813 A1The Research Foundation for The State University of New York
- Three-dimensional printing of metal objects using binding agent with copper nitrate1 Oct 2026US 2026/0295674 A1Peridot Print LLC
- Method of producing a brush1 Oct 2026US 2026/0302708 A1
Most cited
By later US patents
- Hardfacing alloy and hardfacing member34US 10,961,607 B2Kabushiki Kaisha Toyota Chuo Kenkyusho · 2021
- Conductive paste for external electrode and method for manufacturing electronic component including the conductive paste for external electrode23US 10,529,486 B2Murata Manufacturing Co., Ltd. · 2020
- Direct writing for additive manufacturing systems21US 9,533,451 B23D Systems, Inc. · 2017
- Systems and methods for fabricating objects including amorphous metal using techniques akin to additive manufacturing20US 9,579,718 B2California Institute of Technology · 2017
- Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components14US 9,374,892 B1Triton Microtechnologies · 2016