Composite copper particles, method for producing same, and use of same
AssigneeIshihara Sangyo Kaisha, Ltd.
InventorsHironori KATO, Masayoshi UTSUNOMIYA
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AssigneeIshihara Sangyo Kaisha, Ltd.
InventorsHironori KATO, Masayoshi UTSUNOMIYA
Estimating the term…
The present invention provides: composite copper particles which are suitable as a starting material for a paste that can be sintered even in an inert atmosphere and can be applied to a pressureless bonding method and for a bonding member that contains the paste; and a method for producing the composite copper particles. The present invention provides composite copper particles which contain copper particles, a monocarboxylic acid or a salt thereof, and a compound represented by general formula 1: R1(OCH2CH2)nOR2. (In the formula, R1 represents an alkyl group, an aryl group or a hydrogen atom; R2 represents an alkyl group, an aryl group, a hydrogen atom or an acetyl group; and n represents an integer of 1 to 4. However, the cases where both R1 and R2 are hydrogen atoms are excluded.) The composite copper particles have an average particle diameter of 170 nm to 600 nm inclusive as measured by a scanning electron microscope.
Composite copper particles comprising:
A method for producing composite copper particles having an average particle diameter of 170 nm or more and 600 nm or less measured by means of a scanning electron microscope, the method comprising a step of mixing copper particles, a monocarboxylic acid or a salt thereof, a compound represented by general formula 1:
Dependencies are inferred from the claim text.