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US 9,374,892 B1Granted
Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components
AssigneeTriton Microtechnologies
InventorsTim Mobley, Roupen Leon Keusseyan
Life of this patent
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Abstract
A paste material for filling a through-hole for improved adhesion and hermeticity in glass substrates. In some embodiments, the paste material comprises a metal, a glass frit composition, a solvent, a resin, a conductive or non-conductive inert additive, or mixtures thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.
Claims7
A paste material for filling a through-hole, said paste material comprising:
- a. a Cu powder having a particle size ranging from 2 to 10 microns for D50;
- b. a glass frit composition comprising oxides and compounds of Pb, wherein a glass frit particle size of the glass frit composition ranges from 6 to 24 microns for D50;
- c. an ester alcohol solvent;
- d. an ethyl cellulose resin;
- and
- e. a non-conductive Al2O3 additive and a conductive molybdenum additive;
- wherein the paste material has an improved adhesion to the through-hole, wherein the solvent maintains a paste consistency of the paste material when filling the through-hole;
- and wherein the through-hole filled with the paste material is hermetic.
5 more elements
Dependencies are inferred from the claim text.