B05C 11/1042
Provided with means for heating or cooling the liquid or other fluent
Official title: {provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus}
B05C11/1042 (Provided with means for heating or cooling the liquid or other fluent) appears on 385 US grants and 381 published applications in this corpus.
Search patents in B05C- Granted patents
- 385
- Published applications
- 381
- Assignees
- 176
- Inventors
- 697
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 5 | 0 |
| 1984 | 6 | 0 |
| 1985 | 7 | 0 |
| 1986 | 8 | 0 |
| 1987 | 5 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 9 | 0 |
| 1999 | 12 | 0 |
| 2000 | 12 | 0 |
| 2001 | 3 | 6 |
| 2002 | 13 | 4 |
| 2003 | 7 | 5 |
| 2004 | 5 | 11 |
| 2005 | 3 | 15 |
| 2006 | 5 | 12 |
| 2007 | 8 | 5 |
| 2008 | 6 | 13 |
| 2009 | 6 | 5 |
| 2010 | 8 | 11 |
| 2011 | 5 | 5 |
| 2012 | 8 | 4 |
| 2013 | 5 | 26 |
| 2014 | 6 | 32 |
| 2015 | 9 | 20 |
| 2016 | 17 | 31 |
| 2017 | 23 | 19 |
| 2018 | 19 | 32 |
| 2019 | 23 | 14 |
| 2020 | 17 | 20 |
| 2021 | 14 | 18 |
| 2022 | 15 | 25 |
| 2023 | 14 | 16 |
| 2024 | 17 | 16 |
| 2025 | 12 | 8 |
| 2026 | 6 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Edge-banding machine with pneumatic adhesive granulate feed29 Sep 2026US 12,746,568 B2Maschinenbau Hebrock GmbH
- System and method for monitoring liquid adhesive flow29 Sep 2026US 12,747,968 B2Nordson Corporation
- Liquid supply unit having tank provided with circulation line, apparatus for treating substrate, including the same, and method of treating substrate11 Aug 2026US 12,702,998 B2Semes Co., Ltd.
- Slurry supply device and slurry supply method2 Jun 2026US 12,643,123 B2LG Energy Solution, Ltd.
- Device for applying compounds and the use thereof26 May 2026US 12,636,675 B2Staedtler SE
- Liquid sealant pack with peristaltic pump and dispensing system16 Jul 2026US 2026/0199930 A1
- Substrate processing apparatus and substrate processing method9 Jul 2026US 2026/0192320 A1SCREEN Holdings Co., Ltd.
- Hot melt adhesive foam dispensing system implementing a heat exchanger and process implementing a hot melt adhesive foam dispensing system25 Jun 2026US 2026/0175239 A1Nordson Corporation
- Electrode slurry storage device11 Jun 2026US 2026/0158456 A1Samsung SDI.Co., Ltd.
- Dispenser, recording medium, and adhered body manufacturing method11 Jun 2026US 2026/0158747 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Flip chip underfill system and method102US 5,906,682 ANordson Corporation · 1999
- Inferential temperature control system84US 7,510,895 B2Nordson Corporation · 2009
- Variable volume positive displacement dispensing system and method76US 6,514,569 B12003
- Segmented applicator for hot melt adhesives or other thermoplastic materials71US 6,422,428 B1Nordson Corporation · 2002
- Chemical coating apparatus57US 4,932,353 AMitsubishi Denki Kabushiki Kaisha · 1990