Viagan Ltd.
Aichron Yaakov, IL· latest recorded location
VIAGAN LTD. is named on 1 US grants and 5 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 1
- Published applications
- 5
- Inventors
- 3
- Granted in 2026 so far
- 0
- Most recent grant
- 22 Nov 2016
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 3 |
By publication year.
Technology areas
Share of 6 documents
Recent patents
- Wafer Level Packaging of Electronic Devices13 Oct 2016US 2016/0300991 A1
- Wafer level packaging of electronic device21 Apr 2016US 2016/0111616 A1
- Wafer level packaging of electronic device7 Apr 2016US 2016/0099206 A1
- Light Emitting Diode Package with Enhanced Heat Conduction13 Feb 2014US 2014/0042479 A1
- Wafer Level Packaging of Electronic Devices18 Oct 2012US 2012/0261697 A1
Most cited
By later US patents