Wafer Level Packaging of Electronic Devices

A method of forming an electronic device package comprising:

• providing an electronic device comprising a first contact point;
• depositing a metal pad to provide electrical connection to said first contact point;
• providing a substrate comprising a first face and a second face opposing the first face of said substrate;
• attaching said provided electronic device to said provided substrate, such that the first face of said provided substrate is adjacent a face of said provided electronic device;
• etching a vertical interconnect access (VIA) from said second face of said substrate to said metal pad;
• applying an electrically insulating first passivation layer to said second face of said substrate, said electrically insulating first passivation layer in contact with a surface of said etched via;
• drilling a contact hole through said electrically insulating first passivation layer at an apex of said etched via to at least contact said deposited metal pad;
• and
• depositing a metal layer to the second face of the electrically insulating first passivation layer so as to provide electrical conductivity to said deposited metal pad from an area adjacent the second face of the substrate.