Wafer level packaging of electronic device
AssigneeViagan Ltd.
InventorMordechai Margalit
Life of this patent
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Abstract
Wafer level packaged semiconductor device with enhanced heat dissipation properties. The semiconductor device includes a top and a bottom face and at least one metal pad is positioned on the top and the bottom faces. A top cover is affixed to the top face of the semiconductor device and a bottom cover is affixed to the bottom face of the semiconductor device. Vias extend through the top and bottom covers and an electroplated metal layer extends from an external face of the covers, through the visas to the metal pads on the semiconductor device.
Claims9
A wafer level packaging of semiconductor devices comprising:
- a semiconductor device with a top face and bottom face and at least one metal pad located on top and bottom face and;
- a top cover wafer affixed to the top face of semiconductor device and;
- a bottom cover wafer affixed to the bottom face of semiconductor device;
- whereas the top and bottom cover wafers have vias extending from an external face of each cover wafer to internal face of said cover wafer;
- and wherein an electroplated metal layer extends from the external face of each cover wafer through the via to the metal pad.
A method of wafer level packaging of semiconductor devices comprising:
- attaching multiple semiconductor devices to a bottom wafer, wherein each of the semiconductor devices includes at least one metal pad on a top surface of each semiconductor device and at least one metal pad on a bottom surface of each semiconductor device;
- applying an encapsulation layer over the semiconductor devices and the bottom wafer;
- attaching a top wafer over the encapsulation layer;
- creating vias in the top wafer, wherein the vias in the top wafer extend from an external surface of the top wafer to the metal pads on the top surface of each semiconductor device;
- creating vias in the bottom wafer, wherein the vias in the bottom wafer extend from an external surface of the bottom wafer to the metal pads on the bottom surface of each semiconductor device;
- and
- electroplating a metal layer to connect the metal pads of the semiconductor devices, through the via to an external face of the top or bottom wafer.
A wafer level packaging for semiconductor devices, wherein the semiconductor device includes a top face and a bottom face and one or more metal pads located on the top face or the bottom face, the wafer level packaging comprising:
- a first wafer cover that includes an external face and an internal face, the first wafer cover is affixed to the top face of semiconductor device by mating the internal face of the first wafer cover to the top face of the semiconductor device;
- a second wafer cover that includes an external face and an internal face, the second wafer cover is affixed to the bottom face of semiconductor device by mating the internal face of the second wafer cover to the bottom face of the semiconductor device;
- the first wafer cover including one or more apertures that extend from the external face of the first wafer cover to the internal face of the first wafer cover, wherein at least one of the one or more apertures aligns with at least one of the one or more metal pads located on the top face of the semiconductor device;
- the second wafer cover including one or more apertures that extend from the external face of the second wafer cover to the internal face of the second wafer cover, wherein at least one of the one or more apertures aligns with at least one of the one or more metal pads located on the bottom face of the semiconductor device;
- and
- wherein an electroplated metal layer extends from the external face of the first wafer cover wafer through the aperture to the at least one metal pad on the top surface of the semiconductor device and an electroplated metal layer extends from the external face of the second wafer cover wafer through the aperture to the at least one metal pad on the bottom surface of the semiconductor device.
Dependencies are inferred from the claim text.