Versiv Composites Limited
Kilrush, IE· latest recorded location
VERSIV COMPOSITES LIMITED is named on 6 US grants and 0 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 6
- Published applications
- 0
- Inventors
- 8
- Granted in 2026 so far
- 0
- Most recent grant
- 19 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2024 | 2 | 0 |
| 2025 | 4 | 0 |
By publication year.
Technology areas
Share of 6 documents
Recent patents
- Dielectric substrate and method of forming the same19 Aug 2025US 12,391,850 B2
- Copper-clad laminate and method of forming the same25 Mar 2025US 12,262,468 B2
- Solenoid low friction bearing liner11 Mar 2025US 12,247,619 B2
- Dielectric substrate and method of forming the same11 Mar 2025US 12,250,767 B2
- Copper-clad laminate and method of forming the same24 Dec 2024US 12,173,201 B2
No published applications.
Most cited
By later US patents
None of its patents has been cited by a later US patent yet.