Copper-clad laminate and method of forming the same
AssigneeVersiv Composites Limited
InventorsJennifer Adamchuk, Dale Thomas, Meghann White, Sethumadhavan Ravichandran, Gerard T. Buss
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to a copper-clad laminate that may include a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.
Claims20
A copper-clad laminate comprising:
- a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer, wherein the dielectric coating comprises:
- a resin matrix component;
- and
- a ceramic filler component,
- wherein the ceramic filler component comprises a first filler material,
- wherein the dielectric coating has an average thickness of not greater than about 20 microns, and
- wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric coating of at least about 6 lb/in.
A printed circuit board comprising a copper-clad laminate, wherein the copper-clad laminate comprises:
- a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer, wherein the dielectric coating comprises:
- a resin matrix component;
- and
- a ceramic filler component,
- wherein the ceramic filler component comprises a first filler material,
- wherein the dielectric coating has an average thickness of not greater than 20 microns, and
- wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric coating of at least about 6 lb/in.
A method of forming a copper-clad laminate, wherein the method comprises:
- providing a copper foil layer,
- applying a fluoropolymer based adhesive layer overlying the copper foil layer,
- combining a resin matrix precursor component and a ceramic filler precursor component to form a forming mixture,
- forming the forming mixture into a dielectric coating overlying the fluoropolymer based adhesive layer,
- wherein the dielectric coating has an average thickness of not greater than about 20 microns, and
- wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric coating of at least about 6 lb/in.
Dependencies are inferred from the claim text.