Dielectric substrate and method of forming the same
AssigneeVersiv Composites Limited
InventorsJennifer Adamchuk, Gerard T. Buss, Theresa M. Besozzi
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Abstract
The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
Claims21
A dielectric substrate comprising:
- a polyimide layer and
- a first filled polymer layer overlying the polyimide layer, wherein the first filled polymer layer comprises a first resin matrix component;
- and
- a first ceramic filler component, wherein the first ceramic filler component comprises a first filler material, wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns, and
- wherein the first filler material further comprises an average surface area of not greater than about 10 m2/g.
A copper-clad laminate comprising a copper foil layer, and a dielectric substrate overlying the copper foil layer, wherein the dielectric substrate comprises:
- a polyimide layer and a first filled polymer layer overlying the polyimide layer,
- wherein the first filled polymer layer comprises a first resin matrix component;
- and a first ceramic filler component,
- wherein the first ceramic filler component comprises a first filler material, and
- wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns, and
- wherein the first filler material further comprises an average surface area of not greater than about 10 m2/g.
A printed circuit board comprising a copper-clad laminate, wherein the copper-clad laminate comprises:
- a copper foil layer, and a dielectric substrate overlying the copper foil layer, wherein the dielectric substrate comprises:
- a polyimide layer and a first filled polymer layer overlying the polyimide layer,
- wherein the first filled polymer layer comprises a first resin matrix component;
- and a first ceramic filler component,
- wherein the first ceramic filler component comprises a first filler material, and
- wherein the first filler material further comprises a mean particle size of at not greater than about 10 microns, and
- wherein the first filler material further comprises an average surface area of not greater than about 10 m2/g.
Dependencies are inferred from the claim text.