Copper-clad laminate and method of forming the same
AssigneeVersiv Composites Limited
InventorsJennifer Adamchuk, Gerard T. Buss, Theresa M. Besozzi
Life of this patent
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Abstract
The present disclosure relates to a copper-clad laminate that may include a copper foil layer and a dielectric coating overlying the copper foil layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.
Claims19
A copper-clad laminate comprising:
- a copper foil layer, and a dielectric coating overlying the copper foil layer, wherein the dielectric coating comprises:
- a resin matrix component;
- and
- a ceramic filler component,
- wherein the ceramic filler component comprises a first filler material wherein the content of the ceramic filler component is at least 30 vol. % for a total volume of the dielectric coating,
- wherein the dielectric coating has an average thickness of not greater than about 20 microns, and
- wherein the first filler material comprises silica and has a D50 particle size distribution of at least about 0.5 microns and not greater than about 2.7 microns, and
- wherein the dielectric coating has a porosity of not greater than about 8 vol. %.
A printed circuit board comprising a copper-clad laminate, wherein the copper-clad laminate comprises:
- a copper foil layer, and a dielectric coating overlying the copper foil layer, wherein the dielectric coating comprises:
- a resin matrix component;
- and
- a ceramic filler component,
- wherein the ceramic filler component comprises a first filler material wherein the content of the ceramic filler component is at least 30 vol. % for a total volume of the dielectric coating, and
- wherein the dielectric coating has an average thickness of not greater than 20 microns, and
- wherein the first filler material comprises silica and has a D50 particle size distribution of
- at least about 0.5 microns and not greater than about 2.7 microns, and
- wherein the dielectric coating has a porosity of not greater than about 8 vol. %.
A method of forming a copper-clad laminate, wherein the method comprises:
- providing a copper foil layer,
- combining a resin matrix precursor component and a ceramic filler precursor component to form a forming mixture,
- forming the forming mixture into a dielectric coating overlying the copper foil, wherein the dielectric coating has an average thickness of not greater than about 20 microns
- wherein the ceramic filler precursor component comprises a first filler material wherein the content of the ceramic filler component is at least 30 vol. % for a total volume of the dielectric coating,
- wherein the first filler material comprises silica and has a D50 particle size distribution of at least about 0.5 microns and not greater than about 2.7 microns, and
- wherein the dielectric coating has a porosity of not greater than about 8 vol. %.
Dependencies are inferred from the claim text.