Stack Devices Corp.
Miaoli, TW· latest recorded location
Stack Devices Corp. is named on 1 US grants and 7 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 1
- Published applications
- 7
- Inventors
- 9
- Granted in 2026 so far
- 0
- Most recent grant
- 31 May 2005
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 1 | 4 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 0 | 1 |
By publication year.
Technology areas
Share of 8 documents
Recent patents
- Method of package for sensor chip30 Jul 2015US 2015/0214416 A1
- Image sensor packaging method19 Jun 2014US 2014/0170796 A1
- Sensor chip protective image sensor packaging method19 Jun 2014US 2014/0170797 A1
- Method of fabricating stacked semiconductor device17 Nov 2005US 2005/0255632 A1
- Stacked semiconductor device13 Oct 2005US 2005/0224944 A1
Most cited
By later US patents