Method of package for sensor chip

Abstract

A method of package for sensor chip includes the steps of: a) providing a sensor chip having a plurality of conducting contacts and a sensing area, b) using an adhesive to bond the sensor chip on a circuit substrate, c) mounting a dam between the sensing area and conducting contacts of the sensor chip, d) connecting metal conducting wires between the conducting contacts of the circuit substrate and the conducting contacts of the sensor chip, and e) molding a molding compound on the circuit substrate and the sensor chip to cover the metal conducting wires and the dam. Thus, the dam can buffer the impact of stress on the sensor chip during the step e). Further, an open type sensing space is defined after the step e), facilitating signal or status sensing and improving the sensor chip package yield rate.

Dependencies are inferred from the claim text.