Stacked semiconductor device
AssigneeStack Devices Corp.
InventorsJin-Chyung Biar, Wu-Chiang Yao, Chi-Pang Huang
Life of this patent
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Abstract
A stacked semiconductor device has a substrate having a conductor pattern and a cavity. A first die is received in the cavity of the cavity of the substrate and is electrically connected to the conductor pattern via wires. An adhesive layer is printed on a top of the first die. A second die is stacked on the first die via the adhesive layer and is electrically connected to the conductor pattern via wires, and An insulating layer provided on the substrate, wherein the insulating layer cover the first die and the second die and has a portion thereof received in the cavity to bond the first die.
Claims11
A stacked semiconductor device, comprising:
- a substrate having a conductor pattern and a cavity;
- a first die received in the cavity of the cavity of the substrate and electrically connected to the conductor pattern via wires;
- a second die stacked on the first die and electrically connected to the conductor pattern via wires, and
- an insulating layer provided on the substrate, wherein the insulating layer cover the first die and the second die and has a portion thereof received in the cavity to bond the first die.
A stacked semiconductor device, comprising:
- a substrate having a conductor pattern and a cavity;
- a first die received in the cavity of the cavity of the substrate and electrically connected to the conductor pattern via wires;
- an adhesive layer provided on a top of the first die and received in the cavity to bond the first die;
- a second die bonded on the adhesive layer and electrically connected to the conductor pattern via wires, and
- an insulating layer provided on the substrate, wherein the insulating layer cover the second die.
Dependencies are inferred from the claim text.