Micro Processing Technology, Inc.
Lafayette, CA, US· latest recorded location
Micro Processing Technology, Inc. is named on 10 US grants and 0 published applications in this corpus. Its most frequent classification is H10P (Generic processes or apparatus for the manufacture or treatment of devices covered).
- Granted patents
- 10
- Published applications
- 0
- Inventors
- 6
- Granted in 2026 so far
- 0
- Most recent grant
- 6 Oct 2015
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 2 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 1 | 0 |
| 2014 | 1 | 0 |
| 2015 | 1 | 0 |
By publication year.
Technology areas
Share of 10 documents
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered10
- B28DWorking stone or stone-like materials3
- Y10TTechnical subjects covered by former us classification3
- B26DCutting2
- B27BSaws for wood or similar material2
- B24BMachines, devices, or processes for grinding or polishing1
- B26FPerforating1
Recent patents
- System for separating devices from a semiconductor wafer6 Oct 2015US 9,153,493 B1
- Method using fluid pressure to remove back metal from semiconductor wafer scribe streets9 Dec 2014US 8,906,745 B1
- Method of removing back metal from an etched semiconductor scribe street28 May 2013US 8,450,188 B1
- System for breaking a semiconductor wafer or other workpiece along a scribe line17 Jul 2012US 8,220,685 B1
- Method and apparatus for improving force control in wafer scribing5 Oct 2010US 7,807,479 B1
No published applications.
Most cited
By later US patents
- Method for fabricating an integrated circuit49US 6,022,807 A2000
- Semiconductor wafer scribing system16US 6,826,840 B12004
- Method of removing back metal from an etched semiconductor scribe street16US 8,450,188 B12013
- Method using fluid pressure to remove back metal from semiconductor wafer scribe streets16US 8,906,745 B12014
- System for breaking a semiconductor wafer or other workpiece along a scribe line11US 8,220,685 B12012