Method for fabricating an integrated circuit
AssigneeMicro Processing Technology, Inc.
InventorsPaul C. Lindsey, Jr., Robert J. McClelland
Life of this patent
Estimating the term…
Abstract
An apparatus 100 for removing surface non-uniformities is provided. This apparatus has a stage 103 for holding a substrate 127 to be processed. This substrate often includes a film thereon, where the film has the non-uniformities. The apparatus 200 includes a movable head 111, which can provide rotatable movement about a fixed axis 123. A drive motor 115 is operably attached to the movable head 111 to provide this rotatable movement. A pad 113 (e.g., polishing or planarizing pad) is attached to the movable head. This pad 113 comprises an abrasive material and also has a smaller length (e.g, diameter, etc.) relative to a length (e.g, diameter, etc.) of the substrate. The smaller pad is capable of selectively removing a portion of the non-uniformities on the film.
Claims19
A method for fabricating an integrated circuit, said method comprising:
- providing a semiconductor wafer having a film thereon, said film having a surface that is non-uniform;
- providing a pad comprising abrasive material, said pad defining an opening configured to be an orifice for fluid flow;
- and
- rotating said pad and applying said pad against said film, said applying occurring at a selected force to remove a portion of said surface where said surface is non-uniform;
- wherein said pad has a substantially smaller diameter than a diameter of said semiconductor wafer.
A method of fabricating an integrated circuit, said method comprising:
- providing a semiconductor wafer having a film thereon, said film having a surface that is non-uniform;
- providing a pad comprising abrasive material, said pad defining an opening configured to be an orifice for fluid flow, said pad having a substantially smaller diameter than a diameter of said semiconductor wafer;
- rotating said pad and applying said pad against said film, said applying occurring at a selected force to remove a portion of said surface where said surface is non-uniform;
- and
- conditioning said pad.
A method of fabricating an integrated circuit, said method comprising:
- providing a semiconductor wafer having a film thereon, said film having a surface that is non-uniform;
- providing a pad comprising abrasive material, said pad defining an opening configured to be an orifice for fluid flow, said pad having a substantially smaller diameter than a diameter of said semiconductor wafer;
- rotating said pad and applying said pad against said film, said applying occurring at a selected force to remove a portion of said surface where said surface is non-uniform;
- and
- maintaining a face of said semiconductor wafer substantially perpendicular to the ground at a semiconductor fabrication plant to permit fluid to flow off said semiconductor wafer via gravity.
Dependencies are inferred from the claim text.