Materials Technology Corporation
Hsinchu City, TW· latest recorded location
Materials Technology Corporation is named on 5 US grants and 9 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 5
- Published applications
- 9
- Inventors
- 7
- Granted in 2026 so far
- 1
- Most recent grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2021 | 0 | 1 |
| 2022 | 1 | 2 |
| 2023 | 1 | 3 |
| 2024 | 1 | 2 |
| 2025 | 1 | 1 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 14 documents
Recent patents
- Die bonding structure and method of manufacturing the same29 Sep 2026US 12,751,124 B2
- Nano-twinned structure on metallic thin film surface and method for forming the same7 Jan 2025US 12,191,274 B2
- Bonding structures and methods for forming the same19 Nov 2024US 12,148,725 B2
- Bonding structures and methods for forming the same5 Dec 2023US 11,837,568 B2
- Silver nano-twinned thin film structure and method for forming the same1 Nov 2022US 11,488,920 B2
- Die bonding structure and method of manufacturing the same1 May 2025US 2025/0140733 A1
- Back side metallization thin film structure and method for forming the same23 May 2024US 2024/0170434 A1
- Nano-twinned ultra-thin metallic film structure and methods for forming the same16 May 2024US 2024/0158907 A1
- Nano-twinned structure on metallic thin film surface and method for forming the same23 Mar 2023US 2023/0090030 A1
- Metallic nano-twinned thin film structure and method for forming the same23 Feb 2023US 2023/0057312 A1
Most cited
By later US patents