Interplex NAS, Inc.
College Point, NY, US· latest recorded location
Interplex NAS, Inc. is named on 10 US grants and 13 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 10
- Published applications
- 13
- Inventors
- 15
- Granted in 2026 so far
- 0
- Most recent grant
- 5 Jul 2011
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 2 |
| 2005 | 1 | 1 |
| 2006 | 1 | 1 |
| 2007 | 1 | 3 |
| 2008 | 1 | 2 |
| 2009 | 2 | 4 |
| 2010 | 3 | 0 |
| 2011 | 1 | 0 |
By publication year.
Technology areas
Share of 23 documents
- H05KPrinted circuits13
- Y02PLow-carbon manufacturing7
- Y10TTechnical subjects covered by former us classification6
- B23KSoldering or unsoldering5
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by4
- H01RElectrically-conductive connections3
- B22DCasting of metals2
- B26BHand-held cutting tools not otherwise provided for2
- C23FNon-mechanical removal of metallic material from surface2
- C25FProcesses for the electrolytic removal of materials from objects2
Recent patents
- Method and apparatus for die casting of parts5 Jul 2011US 7,971,628 B2
- Planar spring assembly with attached solder strip and method for making same21 Dec 2010US 7,855,490 B2
- Sliding mechanism with spring positioning14 Dec 2010US 7,853,300 B2
- Solder wire construction9 Nov 2010US 7,829,791 B2
- Method for forming an etched soft edge metal foil and the product thereof22 Sep 2009US 7,591,955 B2
- Press fit (compliant) terminal and other connectors with tin-silver compound24 Sep 2009US 2009/0239398 A1
- Solder wire construction9 Jul 2009US 2009/0173517 A1
- Planar spring assembly with attached solder strip and method for making same21 May 2009US 2009/0127982 A1
- Method and apparatus for die casting of parts15 Jan 2009US 2009/0017324 A1
- High Density Interconnection Device With Dielectric Coating17 Jul 2008US 2008/0171474 A1
Most cited
By later US patents
- Two-piece electrical RF shield and method of manufacturing the same40US 6,870,091 B22005
- Method of retaining a solder mass on an article13US 7,189,083 B22007
- Openable one-piece electrical RF shield and method of manufacturing the same10US 7,095,626 B22006
- Solder-bearing contacts and method of manufacture thereof and use in connectors5US 7,347,750 B22008
- Sliding mechanism with spring positioning3US 7,853,300 B22010