Solder wire construction
AssigneeInterplex NAS, Inc.
InventorsJack Seidler, James R. Zanolli, Joseph S. Cachina
Life of this patent
Estimating the term…
Abstract
A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.
Claims18
A device for electrically connecting first and second electrical components each component having at least one electrical contact, the device comprising:
- a carrier for receiving the first and second electrical components, the carrier having a plurality of compartments;
- at least one of the compartments being adjacent to the at least one contact of the first electrical component when received in the carrier;
- at least one of the compartments being adjacent to the at least one contact of the second electrical component when received in the carrier;
- a plurality of solder constructions, each disposed in a respective one of the compartments in the carrier for engagement with a confronting contact of respective electrical components and electrical connection to the electrical components received in the carrier;
- each of the solder constructions having a conductive wire and a solder component adjacent the conductive wire, such that upon reflow of the solder constructions, the at least one contact of the first electrical component is electrically connected to the at least one contact of the second electrical component,
- wherein the solder construction includes a plurality of solder components in the form of solder wires disposed around a circumference of the conductive wire.
A device for electrically connecting first and second electrical components each component having at least one electrical contact, the device comprising:
- a carrier for receiving the first and second electrical components, the carrier having a plurality of compartments and structured and arranged to receive the first and second electrical components in one of an orthogonal orientation or in a side-by-side orientation;
- at least one of the compartments being adjacent to the at least one contact of the first electrical component when received in the carrier;
- at least one of the compartments being adjacent to the at least one contact of the second electrical component when received in the carrier;
- a plurality of solder constructions, each disposed in a respective one of the compartments in the carrier for engagement with a confronting contact of respective electrical components and electrical connection to the electrical components received in the carrier;
- each of the solder constructions having a conductive wire and a solder component adjacent the conductive wire, such that upon reflow of the solder constructions, the at least one contact of the first electrical component is electrically connected to the at least one contact of the second electrical component.
A device for electrically connecting first and second electrical components each component having at least one electrical contact, the device comprising:
- a carrier for receiving the first and second electrical components, the carrier having a plurality of compartments;
- at least one of the compartments being adjacent to the at least one contact of the first electrical component when received in the carrier;
- at least one of the compartments being adjacent to the at least one contact of the second electrical component when received in the carrier;
- a plurality of solder constructions, each disposed in a respective one of the compartments in the carrier for engagement with a confronting contact of respective electrical components and electrical connection to the electrical components received in the carrier;
- each of the solder constructions having a conductive wire and a solder component adjacent the conductive wire, such that upon reflow of the solder constructions, the at least one contact of the first electrical component is electrically connected to the at least one contact of the second electrical component,
- wherein the solder construction includes:
- a conductive wire of non-reflowable material and having an arcuate outer surface;
- a solder component of generally C-shape and having a curved face partially surrounding the outer surface of the conductive wire.
A device for electrically connecting first and second electrical components each component having at least one electrical contact, the device comprising:
- a carrier for receiving the first and second electrical components, the carrier having a plurality of compartments;
- at least one of the compartments being adjacent to the at least one contact of the first electrical component when received in the carrier;
- at least one of the compartments being adjacent to the at least one contact of the second electrical component when received in the carrier;
- a plurality of solder constructions, each disposed in a respective one of the compartments in the carrier for engagement with a confronting contact of respective electrical components and electrical connection to the electrical components received in the carrier;
- each of the solder constructions having a conductive wire and a solder component adjacent the conductive wire, such that upon reflow of the solder constructions, the at least one contact of the first electrical component is electrically connected to the at least one contact of the second electrical component,
- wherein the solder construction includes:
- a solder component of generally C-shape and having two spaced ends and a curved channel therebetween;
- the conductive wire being retained in the curved channel of the solder component.
A device for electrically connecting first and second electrical components each component having at least one electrical contact, the device comprising:
- a carrier for receiving the first and second electrical components, the carrier having a plurality of compartments;
- at least one of the compartments being adjacent to the at least one contact of the first electrical component when received in the carrier;
- at least one of the compartments being adjacent to the at least one contact of the second electrical component when received in the carrier;
- a plurality of solder constructions, each disposed in a respective one of the compartments in the carrier for engagement with a confronting contact of respective electrical components and electrical connection to the electrical components received in the carrier;
- each of the solder constructions having a conductive wire and a solder component adjacent the conductive wire, such that upon reflow of the solder constructions, the at least one contact of the first electrical component is electrically connected to the at least one contact of the second electrical component,
- wherein the first electrical component has a plurality of contacts lying in a first plane;
- and
- wherein the second electrical component has a plurality of contacts lying in a second plane perpendicular to the first plane;
- each of the solder constructions having a first contact area positioned to engage respective ones of the contacts lying the first plane and a second contact area positioned to engage respective ones of the contact lying in the second plane.
Dependencies are inferred from the claim text.