Method of retaining a solder mass on an article
AssigneeInterplex NAS, Inc.
InventorsJack Seidler, Aleksandr Zhitomirsky
Life of this patent
Estimating the term…
Abstract
A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
Claims10
A solder-bearing article comprising:
- a body having a first face, a second face, and a plurality of openings formed therein;
- and
- a solder mass securely held by the body, the solder mass having a first section disposed along the first face such that the solder mass is disposed over at least some of the plurality of openings, the solder mass having a second section disposed along the second face and in the form of at least one rivet head that forms a part of a solder rivet that extends through one opening from the first face and serves to securely hold the solder mass on the body.
A solder-bearing article comprising:
- a body having a first face, a second face, and a plurality of slots formed therein;
- and
- a solder mass securely held by the body, the solder mass having a first section disposed along the first face such that the solder mass is disposed over at least some of the plurality of slots, the solder mass being deformed so that a plurality of rivet heads are formed along the second face, the rivet heads being part of a plurality of solder rivets that extend through preselected slots from the first face and serve to securely hold the solder mass on the body.
Dependencies are inferred from the claim text.