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US 2009/0173517 A1Published application
Solder wire construction
AssigneeInterplex NAS, Inc.
InventorsJack Seidler, James R. Zanolli, Joseph S. Cachina
Life of this patent
Estimating the term…
Abstract
A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.
Claims18
A solder construction carrier device for connecting electrical components comprising:
- a carrier including a plurality of compartments;
- and
- a solder construction disposed in each of the plurality of compartments, each solder construction comprising a conductive wire and a solder component disposed adjacent to the conductive wire.
A method of electrically connecting first and second electrical components comprising the following steps:
- providing a solder construction carrier between the electrical components, the solder construction carrier including a plurality of compartments, each compartment having a solder construction, each solder construction including a conductive wire and a solder component adjacent the conductive wire;
- disposing the solder construction carrier adjacent to a first electrical component such that each solder construction is adjacent to a respective first contact of the first electrical component;
- disposing the solder construction carrier adjacent the second electrical component such that each solder construction is adjacent to a respective second contact of the second electrical component;
- and
- reflowing the solder component such that the solder construction electrically connects the respective first contacts to respective second contacts.
2 more elements
Dependencies are inferred from the claim text.