Exascaler Inc.
Tokyo, JP· latest recorded location
EXASCALER INC. is named on 15 US grants and 23 published applications in this corpus. Its most frequent classification is G06F (Computing and data processing).
- Granted patents
- 15
- Published applications
- 23
- Inventors
- 4
- Granted in 2026 so far
- 0
- Most recent grant
- 6 Jul 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2017 | 0 | 3 |
| 2018 | 2 | 7 |
| 2019 | 5 | 10 |
| 2020 | 3 | 2 |
| 2021 | 5 | 1 |
By publication year.
Technology areas
Share of 38 documents
- G06FComputing and data processing38
- H05KPrinted circuits38
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by17
- F25DRefrigerators5
- B66DCapstans2
- F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange2
- G05DSystems for controlling or regulating non-electric variables2
- H02MApparatus for conversion between ac and ac, between ac and dc, or2
- Y02EClean energy generation and storage2
- B65DContainers for storage or transport of articles or materials1
Recent patents
- Liquid immersion-cooled electronic device and liquid immersion-cooled processor module6 Jul 2021US 11,058,029 B2
- Cooling system to minimize generation of bubbles inside flow passage by utilizing an auxiliary pump1 Jun 2021US 11,023,021 B2
- Liquid immersion-cooled electronic device and liquid immersion-cooled processor module1 Jun 2021US 11,026,345 B2
- Electronic device for liquid immersion cooling18 May 2021US 11,009,925 B2
- Electronic device for liquid immersion cooling, power supply unit, and cooling system18 May 2021US 11,013,143 B2
- An improved cooling system to minimize generation of bubbles inside flow passage by utilizing an auxiliary pump8 Apr 2021US 2021/0103320 A1
- Cooling system for electronic device26 Nov 2020US 2020/0370845 A1
- Liquid immersion-cooled electronic device and liquid immersion-cooled processor module16 Apr 2020US 2020/0120831 A1
- Electronic device for liquid immersion cooling, power supply unit, and cooling system21 Nov 2019US 2019/0357384 A1
- Electronic device for liquid immersion cooling, power supply unit, and cooling system17 Oct 2019US 2019/0317570 A1
Most cited
By later US patents
- Electronic device for liquid immersion cooling and cooling system using the same14US 10,481,650 B22019
- Electronic apparatus and cooling system for electronic apparatus12US 10,194,559 B22019
- Liquid immersion cooling system9US 10,401,924 B22019
- Electronic-device cooling system8US 10,123,454 B22018
- Electronic apparatus cooling system7US 10,123,453 B22018