Cooling system for electronic device

Abstract

A cooling system 100 for directly cooling an electronic device immersed in a coolant includes a cooling tank 11 containing the coolant C, a leakage receiving portion 21 disposed between the cooling tank 11 and a floor surface so as to receive the coolant L leaked from the cooling tank 11, an additional leakage receiving portion 22 disposed to receive the coolant L overflown from the leakage receiving portion 21 which stores the leaked coolant by a volume in excess of a predetermined volume, and a passage 25 that connects the leakage receiving portions 21 and 23 for passing the overflown coolant L by the volume in excess of the predetermined volume. The system facilitates collection of the accidentally leaked coolant, and ensures to keep the low height of the device for temporarily accumulating the leaked coolant L until it is collected.

Dependencies are inferred from the claim text.